Power Semiconductor Module Clamping Element Design

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Solution Overview

Problem

The mounting of power semiconductor modules with high current capabilities is complex and cost-intensive due to the need for multiple processing steps and limited contact zones, which restricts both electrical and thermal performance.

Innovation Solution

A power semiconductor module design featuring a clamping element that transitions from a first position to a second, allowing for the direct electrical and thermal contact between a module-external connecting conductor and the power semiconductor chip without the need for through-holes, utilizing a clamping device with a clamping wedge, counter-wedge, and optional screw for secure connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a screw joint with through-holes is used to connect the connecting conductor to the connecting element, then the connection is mechanically secure, but the mounting process becomes complex and cost-intensive due to multiple processing steps

Engineering Contradiction:

Improveconnection securityVSAvoidmounting process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the through-holes from both the connecting element and the connecting conductor. Instead of using holes for screw insertion, the connecting element is designed as a solid structure that receives the connecting conductor in a dedicated receiving region, simplifying the mounting process while maintaining secure connection through the solid contact interface.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of creating holes through the connecting element and conductor to establish connection, the invention inverts the approach by having the connecting conductor inserted into a receiving region of the solid connecting element. The connection is established by the direct contact between the conductor and the solid element, reversing the conventional hole-based connection methodology.

Inventive Principle:

Principle #13The other way round (Inversion)

2Ease of manufacture

If through-holes are provided in the connecting element and connecting conductor for screw connection, then mechanical assembly is enabled, but the contact zone is limited which restricts electrical and thermal performance

Engineering Contradiction:

Improveassembly capabilityVSAvoidelectrical and thermal conductivity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention removes the through-holes from the design, eliminating the limitation they impose on contact zone area. The connecting element is provided as a solid structure without holes, allowing the entire surface area of the receiving region to be available for electrical and thermal contact with the connecting conductor, thereby maximizing conductivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Rather than using holes as the connection interface, the invention inverts to a solid-surface contact approach where the connecting conductor makes contact with the solid connecting element across a large surface area in the receiving region, significantly improving electrical and thermal contact performance.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the mounting process, reduces contact resistance, and enhances both electrical and thermal conductivity by eliminating the need for through-holes, thereby improving the overall performance and reducing costs.

Implementation Method 1

the clamping element is then brought from the first position into the second position, the connecting region is clamped to the power semiconductor module with the formation of an electrically conductive connection

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Implementation Method 2

the operating heat that arises in a power semiconductor module is, to a certain degree, also dissipated via its connecting elements and the connecting conductors connected thereto

Methodology Applied

Scientific EffectThermal Conduction: Conduction (thermal)

Data Source

PatentUS8848381B2Power semiconductor module and power semiconductor module system

Publication Date: 2014.09.30 INFINEON TECHNOLOGIES AG

AI summary

A power semiconductor module includes an electrically conductive connecting element, an accommodating region, and a clamping element which can be brought from a first position into a second position. If the clamping element is situated in the first position, a connecting region of a module-external connecting conductor can be inserted into the accommodating region and be clamped to the power semiconductor module with the formation of an electrically conductive connection between the connection region and the connecting element. For this purpose, the clamping element is brought from the first position into the second position.