Power Semiconductor Module Co-Simulation via Indirect Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current multi-physics simulation methods for power semiconductor modules lack precision and efficiency, as they rely on single software platforms that are limited in their ability to accurately model complex interactions between electrical, thermal, and mechanical fields, and fail to achieve steady-state co-simulation across different software types.
Innovation Solution
A multi-physics co-simulation method combining PSpice, COMSOL, and MATLAB, utilizing an indirect coupling interface to perform electricity-heat-force co-simulation, with adaptive step length adjustment and bidirectional data transfer, enabling real-time coupling and feedback of junction temperature data to improve simulation accuracy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If single software platform is used for multi-physics simulation, then device complexity is reduced, but simulation precision deteriorates due to limited ability to model complex interactions
Solution Approach 1:
The patent divides the multi-physics simulation system into separate specialized software platforms: PSpice for electrical circuit simulation, COMSOL for thermal and mechanical field simulation. Each software handles specific physics domains where it excels, rather than forcing a single platform to handle all physics types, thereby maintaining high simulation precision while managing complexity through modular architecture.
Solution Approach 2:
The patent introduces MATLAB as an intermediary software that bridges PSpice and COMSOL. MATLAB coordinates data exchange between the electrical simulation results from PSpice and the thermal-mechanical simulation in COMSOL, enabling bidirectional coupling while managing the complexity of direct integration between specialized platforms.
2Measurement precision
If different software types are combined for co-simulation, then simulation precision is improved, but device complexity increases due to integration requirements
Solution Approach 1:
MATLAB serves as a mediator that simplifies the integration complexity between PSpice and COMSOL. It provides standardized interfaces and automation scripts that handle data format conversion, timing synchronization, and iterative coupling, thereby enabling precise multi-physics co-simulation without requiring complex direct integration between the specialized simulation platforms.
Solution Approach 2:
MATLAB performs multiple functions in the co-simulation system: it acts as a data exchange interface, a timing coordinator, an iterative solver, and a result analyzer. This multi-functionality reduces the need for separate specialized integration tools, managing software complexity while enabling precise bidirectional coupling between electrical and thermal-mechanical simulations.
3Device complexity
If fixed step length is used for data exchange, then device complexity is reduced, but productivity deteriorates due to inability to balance simulation precision and efficiency
Solution Approach 1:
The patent implements dynamic step length adjustment in the co-simulation process. MATLAB automatically adjusts the data exchange step length between PSpice and COMSOL based on the simulation progress and coupling strength, switching between smaller steps during transient phases requiring high precision and larger steps during steady-state phases, thereby optimizing simulation efficiency without excessive complexity.
4Measurement precision
If bidirectional coupling is implemented, then simulation precision is improved, but device complexity increases due to tight coupling requirements
Solution Approach 1:
MATLAB acts as an intermediary that manages the bidirectional coupling between PSpice and COMSOL. It handles the complexity of tight coupling by providing automated iterative loops where electrical simulation results update thermal-mechanical simulations and vice versa, maintaining high multi-physics coupling precision while shielding users from the complexity of direct bidirectional integration.
Data Source
AI summary
The present invention belongs to the technical field of simulation of power semiconductor modules, and discloses a multi-physics co-simulation method of a power semiconductor module. The multi-physics co-simulation method of the power semiconductor module comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. The simulation time is greatly shortened, and the simulation efficiency is improved.