Power Semiconductor Module Contact Spring Assembly
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Solution Overview
Problem
Existing power electronic arrangements in electric vehicles face challenges in achieving effective integration and efficient electrical connections for power semiconductor modules, particularly in compact designs that minimize electromagnetic interference and ensure reliable conductivity.
Innovation Solution
A power electronic arrangement featuring a power semiconductor module with a load connection element and a mounting device, utilizing a contact spring for non-positive electrical contact, where the load connection element protrudes through a metal base plate and is insulated from it, with the contact spring providing indirect or direct electrical conductivity through a helical design, and a pin made of insulating material that extends into the contact spring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the load connection element protrudes through the metal base plate and uses a contact spring for electrical connection, then reliable electrical conductivity is achieved, but the device complexity increases due to additional components and assembly steps
Solution Approach 1:
The contact spring serves as an intermediary element between the load connection element and the mounting device, providing reliable electrical conductivity through controlled pressure contact. The spring's elastic properties ensure continuous electrical connection while accommodating manufacturing tolerances and thermal expansion, thus achieving reliable conductivity without requiring complex rigid connection mechanisms.
Solution Approach 2:
The contact spring introduces dynamic flexibility to the electrical connection system. Its elastic deformation capability allows the connection to adapt to varying conditions (thermal expansion, mechanical stress, assembly tolerances) while maintaining reliable electrical contact. This dynamic approach replaces complex rigid positioning and adjustment mechanisms with a simple elastic element.
2Object-affected harmful factors
If the load connection element is electrically insulated from the base plate, then electromagnetic interference is minimized, but the device complexity increases due to additional insulation requirements
Solution Approach 1:
Electrical insulation is applied locally only where needed - specifically between the load connection element and the metal base plate - rather than insulating the entire assembly. The insulation is concentrated at the critical interface where electromagnetic interference could occur, leaving other areas electrically conductive for optimal performance. This localized approach minimizes electromagnetic interference without requiring comprehensive insulation of the entire device.
3Stability of the object's composition
If a pin made of insulating material extends into the contact spring, then mechanical stability is improved, but electrical conductivity is compromised at that location
Solution Approach 1:
The electrical insulation function is extracted and assigned to a dedicated insulating pin element, separating the mechanical stabilization function from the electrical conduction function. The insulating pin provides mechanical stability by positioning and stabilizing the contact spring without interfering with the electrical conduction path, which flows through the spring itself and the contact surfaces.
Solution Approach 2:
The insulating pin acts as an intermediary that provides mechanical support and positioning to the contact spring assembly without participating in the electrical conduction. It mediates between the mechanical requirements (stability, positioning) and electrical requirements (conductivity) by physically supporting the conductive elements while electrically isolating certain parts of the structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the integration of power semiconductor modules in electric vehicles by ensuring reliable, efficient electrical connections while minimizing electromagnetic interference, and allows for both direct and indirect conductive pressure contact options, improving the overall performance and compactness of the power electronic arrangement.
Implementation Method 1
An electrically conductive pressure contact connection, i.e. a non-positive contact, between the first contact surface and the second contact surface is formed by means of the contact spring
Implementation Method 2
the contact spring being designed as a helical spring
Implementation Method 3
the pin being made of insulating material that extends into the contact spring
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A power electronic arrangement is presented, comprising a power semiconductor module, a contact spring, a load connection element and a mounting device, which is designed as part of an electrically powered vehicle, wherein the power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module and preferably has a first external contact surface there, i.e. a contact surface for the external connection, and wherein the load connection element has a second contact surface.An electrically conductive pressure contact connection between the first contact surface and the second contact surface is formed by means of the contact spring, wherein the necessary pressure on the contact spring is formed by the power semiconductor module being force-fitted to the mounting device and wherein the load connection element protrudes outwards through a metallic base plate of the power semiconductor module, wherein the load connection element is electrically insulated from the base plate.