Power Semiconductor Cooling System with Plenum and Heat Sink
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Solution Overview
Problem
Conventional cooling systems for power semiconductor switches are inefficient, non-uniform, and space-consuming, making them unsuitable for compact electric devices, particularly in applications like static transfer switches where reliable and rapid power switching is critical.
Innovation Solution
A cooling system utilizing heat sinks pressed against power semiconductor switches, aligned with a plenum opening, where a fan directs airflow through or around the heat sinks to absorb and dissipate heat, with redundant fan placement and design to ensure continuous cooling and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional cooling systems are used for power semiconductor switches, then cooling function is provided, but the systems are space-consuming and non-compact
Solution Approach 1:
The cooling system is segmented into modular components: heat sinks attached directly to power semiconductor switches, a plenum chamber, and distributed fans. This segmentation allows the cooling function to be integrated throughout the device rather than requiring a separate centralized cooling system, reducing overall space while maintaining effective cooling coverage.
Solution Approach 2:
The heat sinks are nested within the plenum chamber structure, with the plenum serving as both a structural housing and a cooling air distribution chamber. This nesting eliminates the need for separate cooling housings and reduces the overall volume of the cooling system while maintaining effective heat dissipation pathways.
2Reliability
If conventional cooling systems are used, then cooling is provided, but the cooling is non-uniform and inefficient
Solution Approach 1:
Heat sinks are attached directly to each power semiconductor switch at the location where heat is generated, providing localized cooling exactly where needed. This ensures uniform temperature distribution across different switches rather than relying on distant centralized cooling sources that create temperature gradients and uneven cooling.
Solution Approach 2:
The plenum chamber acts as an intermediary that distributes cooling air uniformly to multiple heat sinks simultaneously. This intermediary structure ensures that each heat sink receives adequate cooling airflow, creating uniform cooling across all power semiconductor switches while maintaining high overall cooling efficiency through the organized air distribution pathway.
3Volume of moving object
If compact design is implemented, then space is reduced, but cooling reliability may be compromised
Solution Approach 1:
The cooling system merges multiple functions into integrated components: the plenum chamber serves as both structural housing and cooling air distribution chamber, heat sinks serve as both heat dissipation devices and mounting structures for power semiconductors, and fans are distributed throughout the compact structure rather than centralized. This merging maintains cooling reliability while achieving compact dimensions.
Solution Approach 2:
The cooling system utilizes three-dimensional air flow pathways within the plenum chamber, with air entering through inlet openings and circulating through vertical and horizontal pathways to reach heat sinks positioned at various heights and locations. This multi-dimensional cooling approach allows effective cooling in a compact volume by充分利用 the available three-dimensional space rather than relying solely on horizontal expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces the temperature of power semiconductor switches, enhancing their reliability and longevity while maintaining a compact form factor, suitable for critical applications like data center power management.
Implementation Method 1
Heat generated by the power semiconductor switch is at least partially absorbed by one or more heat sinks pressed against the power semiconductor switch
Implementation Method 2
A fan draws air through the plenum wall opening and the plenum. As a result, the heat sink is cooled by the airflow directed through or around the heat sink
Data Source
AI summary
A cooling system for power semiconductor switches is provided. The cooling system includes a heat sink that is pressed against the power semiconductor switch. A plenum is also provided with an opening through a wall thereof which is aligned with the heat sink. A fan draws air through or around the heat sink and through the plenum wall opening and the plenum in order to cool the power semiconductor switch.