Power Semiconductor Module Current Sensor Integration

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Solution Overview

Problem

Power semiconductor modules face challenges in measuring current due to limited space for current measuring arrangements, especially when multiple modules are closely arranged along heat sinks, requiring additional space for current measuring arrangements and electrical isolation.

Innovation Solution

The integration of a current sensor within the power semiconductor module, where the sensor is either externally mounted on the terminal, enclosed within the module frame, or positioned internally, allowing for efficient space utilization and effective thermal coupling, while ensuring electrical isolation and protection against mechanical and thermal stresses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a current measuring arrangement is connected externally by means of a busbar, then current measurement is enabled, but a large amount of additional space is required

Engineering Contradiction:

Improvecurrent measurement capabilityVSAvoidspace requirement

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The current sensor is integrated directly into the terminal structure of the power semiconductor module, merging the current measurement function with the existing terminal component. This eliminates the need for separate external current measuring arrangements and busbars, thereby enabling current measurement while minimizing additional space requirements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The terminal serves multiple functions: it acts as both the power connection terminal and the current sensing element. By making the terminal multi-functional, the patent eliminates the need for dedicated external current measuring components, thus enabling current measurement capability without occupying additional space.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Area of stationary object

If multiple power semiconductor modules are arranged closely along a heat sink, then space efficiency is improved, but space for current measuring arrangements becomes limited

Engineering Contradiction:

Improvespace utilizationVSAvoidcurrent measurement capability

Core Design Contradiction:

Area of stationary objectVSMeasurement precision

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If electrical isolation between power semiconductor module and evaluation electronics is required, then safety is improved, but additional space for isolation components is needed

Engineering Contradiction:

Improveelectrical isolationVSAvoidspace requirement

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent employs an intermediary coupling mechanism (such as magnetic coupling or capacitive coupling) between the current sensor and the evaluation electronics. This intermediary allows signal transmission while maintaining electrical isolation, thus achieving both electrical isolation for safety and current measurement capability without requiring additional space for isolation components.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables precise current measurement without occupying additional space, enhances thermal management, and improves the mechanical stability and insulation of the current sensor, addressing the space constraints and isolation issues in power semiconductor modules.

Implementation Method 1

at least one current sensor which is designed to measure a current in a power terminal

Methodology Applied

Scientific EffectMagnetic field detection: Magnetic Field

Implementation Method 2

the power semiconductor module has heat exchangers (e.g., heat sinks) at its underside, which absorb the heat from the components and transfer the heat to the cooling liquid by virtue of the direct contact therewith

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the cooling liquid is heated while it flows along the underside of the module

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS9370113B2Power semiconductor module with current sensor

Publication Date: 2016.06.14 INFINEON TECHNOLOGIES AG

AI summary

A power semiconductor module includes a power electronics substrate having a first surface, a second surface opposite the first surface, a first longitudinal side, a second longitudinal side opposite the first longitudinal side, a module frame, which is arranged to enclose the power electronics substrate, at least one power terminal which is arranged at the first longitudinal side and extends through the module frame, a further terminal, which is arranged at the second longitudinal side and extends through the module frame, at least one power semiconductor component which is arranged on the first surface of the power electronics substrate and is electrically connected to at least one power terminal, and at least one current sensor which is designed to measure a current in a power terminal. The at least one current sensor is arranged on the power terminal and has a signal output connected to the further terminal.