Power Semiconductor Cylindrical Terminal Perpendicular Wiring
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Solution Overview
Problem
Conventional power semiconductor devices sealed with transfer molding resin have limited productivity due to numerous manufacturing processes, restricted size reduction, and limited current capacity due to protruding external terminals and bending processes.
Innovation Solution
A power semiconductor device with a cylindrical external terminal communication section arranged perpendicular to the wiring pattern, sealed with transfer molding resin, allowing for reduced size, increased mounting density, and enhanced current capacity, with a taper at one end for secure solder bonding and easy terminal insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If external terminals are made to protrude from peripheral side surfaces to secure insulation distance, then insulation distance is sufficient, but device size cannot be reduced
Solution Approach 1:
The external terminals are arranged in a planar configuration on the same surface as the power semiconductor elements, transitioning from a three-dimensional protruding structure to a two-dimensional surface-mounted structure. This dimensional change allows terminals to be positioned within the device footprint, reducing overall device size while maintaining adequate insulation distances through proper layout design on the surface plane.
Solution Approach 2:
The external terminals are nested within the boundary of the resin-sealed portion, specifically positioned on the same surface where power semiconductor elements are mounted. This nesting approach allows the terminals to be contained within the device envelope rather than extending outward, enabling compact device sizing while preserving necessary insulation clearances through strategic positioning.
2Ease of operation
If bending process is performed on external terminals, then mounting is enabled, but current capacity is limited due to thickness constraints
Solution Approach 1:
The external terminal structure is segmented into multiple layers or stacked conductive elements, allowing the terminal to achieve greater effective thickness and current-carrying capacity without requiring excessive bending or deformation of a single thin element. This layered construction enables both adequate mechanical flexibility for mounting and sufficient cross-sectional area for high current capacity.
Solution Approach 2:
The external terminals utilize composite construction with multiple conductive layers or materials stacked together, providing both the mechanical properties needed for mounting operations and the electrical properties required for high current capacity. The composite structure allows optimization of both thickness for current handling and flexibility for mounting without the limitations of single-material terminals.
3Reliability
If numerous manufacturing processes are used for bonding external casing and filling silicone gel, then sealing is achieved, but manufacturing time is prolonged
Solution Approach 1:
The external casing is integrated directly with the resin-sealed portion, eliminating the need for separate bonding processes between external casing and internal components. The silicone gel filling and resin sealing processes are merged into a single transfer molding operation, where both functions are achieved simultaneously in one manufacturing step, thereby maintaining reliable sealing while significantly reducing manufacturing time and process complexity.
Solution Approach 2:
The resin-sealed portion serves multiple functions simultaneously: it provides structural encapsulation, thermal management, electrical insulation, and environmental sealing. The external casing is designed to perform both protective enclosure and sealing functions in one component, eliminating the need for separate sealing layers or bonding processes and thereby reducing manufacturing steps while maintaining comprehensive sealing quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact power semiconductor device capable of handling large currents with improved manufacturing yield and productivity by reducing the mounting area and preventing defective solder joints.
Implementation Method 1
a metal plate acting as a heat sink
Implementation Method 2
sealed with transfer molding resin
Implementation Method 3
solder is firmly bonded to the cylindrical external terminal communication section
Data Source
AI summary
A power semiconductor device with improved productivity, reduced size and reduction of amounting area therefore is provided. In the provided power semiconductor device, an external terminal does not limit an increase in current. The power semiconductor device is sealed with transfer molding resin. In the power semiconductor device, a cylindrical external terminal communication section is arranged on a wiring pattern so as to be substantially perpendicular to the wiring pattern. An external terminal can be inserted and connected to the cylindrical external terminal communication section. The cylindrical external terminal communication section allows the inserted external terminal to be electrically connected to the wiring pattern. A taper is formed at, at least, one end of the cylindrical external terminal communication section, which one end is joined to the wiring pattern.