Power Semiconductor Device with Press-Fit Cylindrical Conductors

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Solution Overview

Problem

Existing power semiconductor devices face challenges in reducing size and increasing productivity due to complex and costly wiring processes when connecting multiple power semiconductor modules in parallel, leading to large device sizes and low productivity.

Innovation Solution

A power semiconductor device configuration that includes a power semiconductor module sealed with transfer molding resin and an insert case with external terminals that use press-fit connections to cylindrical conductors, reducing the number of wiring components and simplifying the connection process, allowing for closer module placement and size reduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If power semiconductor modules are wired in parallel to realize large-current operation, then the current capacity is improved, but the device size increases and productivity decreases due to complex wiring processes

Engineering Contradiction:

Improvecurrent capacityVSAvoidproductivity

Core Design Contradiction:

PowerVSProductivity

Solution Approach 1:

The patent merges multiple wiring operations into a single integrated connection process. The connection structure allows multiple power semiconductor modules to be connected simultaneously through a unified mechanism, eliminating the need for sequential wiring operations and thereby improving productivity while maintaining large-current capability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent implements preliminary action by pre-configuring the connection structure with integrated connection terminals and connection portions before the modules are assembled. This pre-prepared connection architecture enables rapid assembly without requiring complex wiring operations during the assembly process, thus enhancing productivity

Inventive Principle:

Principle #10Preliminary action

2Reliability

If connection is performed for each power semiconductor module and for each terminal, then connection reliability is improved, but the number of wiring components increases and connection processes become complex

Engineering Contradiction:

Improveconnection reliabilityVSAvoidconnection process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple individual connection operations into a single integrated connection process. The connection structure features multiple connection terminals that can simultaneously establish connections with multiple modules, reducing the overall complexity of the connection process while maintaining reliable connections for each terminal

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent implements universality by designing a connection structure that serves multiple functions simultaneously. The same connection structure can connect multiple modules in parallel while also providing individual terminal connections, thereby simplifying the overall connection process without compromising connection reliability

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of operation

If space is provided between power semiconductor modules for wiring operations, then wiring accessibility is improved, but the device size increases

Engineering Contradiction:

Improvewiring accessibilityVSAvoiddevice size

Core Design Contradiction:

Ease of operationVSVolume of moving object

Solution Approach 1:

The patent applies preliminary action by pre-configuring the connection structure with integrated connection terminals and connection portions before module assembly. This pre-prepared architecture enables connections to be made without requiring additional space between modules during assembly, allowing compact module placement while maintaining wiring accessibility

Inventive Principle:

Principle #10Preliminary action

4Manufacturing precision

If sequential connection of wiring components is performed for each module, then connection precision is improved, but the number of connection processes increases and productivity decreases

Engineering Contradiction:

Improveconnection precisionVSAvoidproductivity

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges multiple sequential connection processes into a single simultaneous connection operation. The integrated connection structure allows all necessary connections to be established in one process step, maintaining connection precision through the unified design while dramatically improving productivity by eliminating repeated sequential operations

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8610261B2Power semiconductor device

Publication Date: 2013.12.17 MITSUBISHI ELECTRIC CORP

AI summary

A power semiconductor device includes a power semiconductor module having cylindrical conductors which are joined to a wiring pattern so as to be substantially perpendicular to the wiring pattern and whose openings are exposed at a surface of transfer molding resin, and an insert case having a ceiling portion and peripheral walls, the ceiling portion being provided with external terminals that are fitted into, and passed through, the ceiling portion, the external terminals having outer-surface-side connecting portions at the outer surface side of the ceiling portion and inner-surface-side connecting portions at the inner surface side of the ceiling portion. The power semiconductor module is set within the insert case such that the inner-surface-side connecting portions of the external terminals are inserted into the cylindrical conductors.