Power Semiconductor Distance Regulation Moisture Prevention

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Solution Overview

Problem

The existing power semiconductor devices require a process of sealing the space between the sealing body and the case with potting resin, which complicates the manufacturing process and may affect the reliability due to potential moisture absorption by the sealant resin from cooling water.

Innovation Solution

A power semiconductor device design that includes a circuit body with semiconductor elements and conductive portions interposed between insulation and bases, with a case having opening portions covered by the bases and a distance regulation portion to maintain precise spacing, allowing for laser welding and transfer molding to secure the sealant resin without direct contact with cooling water, thus preventing moisture absorption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a process of sealing the space between the sealing body and the case with potting resin is used, then the reliability is improved by preventing moisture ingress, but the manufacturing complexity increases and productivity decreases

Engineering Contradiction:
Improvemoisture preventionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the potting resin sealing process from the manufacturing procedure. Instead of using resin to seal the space between the sealing body and case, the invention uses a sealing member that is integrated with the case structure, thereby removing the complex multi-step sealing process while maintaining moisture prevention functionality

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The sealing function is merged with the case structure itself. The sealing member is formed as an integral part of the case through injection molding, combining the structural support function of the case with the sealing function that previously required a separate potting resin application process

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If potting resin is used to seal the space between the sealing body and the case, then moisture absorption is prevented, but the manufacturing time and cost increase

Engineering Contradiction:
Improvemoisture resistanceVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The sealing member is pre-formed through injection molding as an integral part of the case structure before assembly. This preliminary formation of the sealing structure eliminates the need for subsequent potting resin application, curing, and trimming operations, thereby significantly reducing manufacturing time and improving productivity while maintaining moisture resistance

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention replaces the expensive and time-consuming potting resin process with a simpler, more economical injection-molded sealing member. The sealing member is designed as a single-use, pre-formed component that provides equivalent or superior sealing performance without the need for additional processing steps

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Strength

If the sealing body is crimped with the case and then sealed with potting resin, then the structural integrity is improved, but the manufacturing complexity and time increase

Engineering Contradiction:
Improvestructural integrityVSAvoidsealing process complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The sealing member is merged with the case structure through integral formation by injection molding. This integration maintains structural integrity by creating a unified component that combines the case's mechanical strength with the sealing member's moisture barrier function, while eliminating the complexity of separate crimping and potting operations

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The case and sealing member are formed as a composite structure through injection molding, where the sealing member material is injected into the case structure. This creates a composite component that leverages the mechanical properties of the case material and the sealing properties of the sealing member material, achieving both structural integrity and moisture protection in a single manufacturing step

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11232994B2Power semiconductor device having a distance regulation portion and power conversion apparatus including the same
Publication Date: 2022.01.25 ASTEMO LTD
  • US11232994B2 patent drawing
  • US11232994B2 patent drawing
  • US11232994B2 patent drawing

AI summary

A power semiconductor device includes a circuit body, first and second insulations, first and second bases, a case, and a distance regulation portion. The circuit body incudes a semiconductor element and a conductive portion. The first insulation and the second insulation oppose each other. The first base and second base also oppose each other. The case has a first opening portion covered with the first base and a second opening portion covered with the second base. The distance regulation portion has a first end that contacts the first base and a second end, that is opposite to the first end, and that contacts the second base. The distance regulation portion regulates a distance between the first base and the second base.