Power Semiconductor Explosion-Proof Module with Conductive Particle Cavity
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Solution Overview
Problem
Conventional power semiconductor components, such as thyristors and IGBTs, are prone to destruction during overloads or short circuits due to excessive current and thermal stress, leading to explosions that can damage surrounding components and disrupt the power module's operation.
Innovation Solution
A power module design featuring a cavity filled with conductive particles and a metal layer, where the explosion pressure is directed into the cavity and managed through channels, allowing only a single arc to form and enabling the particles to carry current, while a corrosion-resistant metallization ensures reliable contact and reduced risk of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used for power semiconductor components, then the components can operate under normal conditions, but they explode and destroy surrounding components during short circuits or overloads
Solution Approach 1:
The encapsulation is divided into a hermetic seal and a cavity filled with conductive particles. This segmentation allows the cavity to contain and manage explosion pressures separately from the power semiconductor component, preventing damage to surrounding components while maintaining component reliability during normal operation
Solution Approach 2:
The invention converts the harmful explosion energy into a beneficial current-carrying path by filling the cavity with conductive particles. When a short circuit occurs, the explosion pressure is directed into the cavity where conductive particles provide a path to carry the fault current, preventing the explosion from destroying surrounding components
2Ease of manufacture
If conventional bonding wires are used, then the module can be manufactured with standard processes, but the bonding wires melt or tear off during short circuits causing electric arcs
Solution Approach 1:
Conductive particles are introduced as an intermediary between the power semiconductor component and the external environment. These particles serve as a mediator that can carry fault currents without melting or tearing, replacing the vulnerable bonding wires and preventing electric arcs during short circuits
3Power
If power semiconductor components are connected in parallel, then the switching capacity is increased, but an arc from one component can trigger and overheat other components
Solution Approach 1:
Each power semiconductor component is provided with its own encapsulation containing a cavity filled with conductive particles. This segmentation isolates fault conditions to individual components, preventing arcs from triggering parallel-connected components while maintaining the overall switching capacity of the parallel configuration
4Power
If series circuits of power semiconductor components are used for high voltages, then the voltage handling capability is increased, but a fault in one component can destroy the entire series string
Solution Approach 1:
The cavity filled with conductive particles converts the harmful fault condition into a beneficial current-carrying path. When a component in the series string fails, the conductive particles provide a path to carry the fault current and maintain the series connection, preventing complete destruction of the series string while maintaining high voltage handling capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design prevents destruction of power semiconductor components during overloads, allowing undamaged modules to remain operational and reducing the risk of electrical arcs and thermal damage, ensuring reliable operation and extended component lifespan.
Implementation Method 1
Metal vapors are cooled and condensed
Implementation Method 2
Metal vapors are cooled and condensed
Implementation Method 3
the current flow is taken over by the particle or particles
Implementation Method 4
a corrosion-resistant metallization ensures reliable contact
Data Source
Figure 1~2
AI summary
The invention relates to power modules, particularly power modules comprising at least one electric power component, especially a power electronic semiconductor component (1). An electrical contact for a load current is created on a lower surface and an upper surface of said power semiconductor component (1). In order to reduce an explosion pressure and accept power when the power electronic semiconductor component (1) is overloaded, a hollow space (7) that is filled with at least one electrically conducting particle (5) is formed on an electrical contact surface (9) of the electrical contact. In case of a short circuit, an arc is initially generated above the semiconductor element thickness of the power semiconductor component (1), whereupon the filling in the hollow space (7) takes over current conduction. Preferably, the filling in the hollow space (7) is embodied as a plurality of spherical electrically conducting particles (5). The explosion pressure can escape into the interstices in the filling in case of a short circuit. Furthermore, metal vapors are cooled and are condensed. A duct extending from the hollow space (7) out of the hollow space (7) can additionally be created in order to reduce the explosion pressure, thus preventing power components from demolishing the surroundings thereof during an electrical overload. The invention makes it possible to improve a thyristor, for example.