Power Semiconductor Module Exposed Terminals
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power semiconductor modules have a high space and volume requirement due to the need for pressure-contact springs to compensate for thermomechanical movements between ceramic substrates and organic printed circuit boards, limiting power density and thermal capability.
Innovation Solution
A power semiconductor module design with exposed terminal contacts and substrates allows direct electrical and physical contact, using silver sintering for reliable connections and a thermomechanically adapted package to reduce the need for long spring excursions, enabling flexible and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pressure-contact springs are used to compensate for thermomechanical movements, then reliability of electrical connection is improved, but volume of housing increases
Solution Approach 1:
The patent extracts the function of thermomechanical compensation from the pressure-contact spring by introducing a separate compensating element (such as a flexible circuit board or adjustable mounting structure) that can be independently optimized. This allows the pressure-contact spring to be shortened while maintaining connection reliability, thereby reducing housing volume.
Solution Approach 2:
The patent transitions from direct vertical pressure contact to a multi-dimensional compensation mechanism where thermomechanical movements are accommodated through lateral flexibility or angular adjustment rather than solely through vertical spring excursion, reducing the required spring length and housing volume.
2Adaptability or versatility
If pressure-contact springs with long spring excursion are used, then compensation for thermomechanical movements is improved, but area requirement increases
Solution Approach 1:
The patent resolves this contradiction by moving the compensation mechanism from a vertical dimension (long spring excursion) to lateral or angular dimensions (flexible circuit traces, adjustable mounting angles), thereby maintaining thermomechanical adaptability while reducing the footprint area of the module.
3Reliability
If wire bonding is used to connect semiconductors to substrate terminals, then electrical connection is established, but device complexity increases
Solution Approach 1:
The patent extracts the electrical connection function from the wire bonding process by implementing direct contact terminals that extend through or beyond the substrate, allowing semiconductors to contact substrate terminals directly without intermediate wire bonds, thereby simplifying the overall device structure.
4Device complexity
If direct contact of semiconductors with substrate terminals is implemented, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-positioning the direct contact terminals at their final locations during substrate fabrication, and pre-aligning semiconductor components before mounting. This preliminary positioning and alignment work done during manufacturing processes reduces the actual assembly complexity even though precision requirements are higher.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the module's space and volume requirements, enhances power density, and improves thermal management by allowing direct heat conduction, while maintaining reliable electrical connections.
Implementation Method 1
the bearing surface is connected to the semiconductor by a top side connecting layer between the bearing surface and the semiconductor, the top side connecting layer is a silver sintering layer formed by silver sintering the bearing surface to the semiconductor
Implementation Method 2
The pressure-contact springs are made to be of a sufficient length to be able to compensate for the tolerance due to thermal expansion between the ceramic-based substrate of the power module and the organic printed circuit board
Implementation Method 3
The pressure-contact springs are made to be of a sufficient length to be able to compensate for the tolerance
Implementation Method 4
allowing heat to be with advantage conducted away from the power semiconductor module
Data Source
AI summary
The present invention discloses a power semiconductor module, comprising: a substrate; a semiconductor provided on a top side of the substrate; and a package formed on the semiconductor and the substrate, wherein the package has openings at a top side thereof, through which terminal contacts of the semiconductor and the substrate are exposed outside and accessible from outside.