Power Semiconductor Device Heterojunction Design

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Wide-gap semiconducting materials, such as gallium oxide, face challenges in achieving p-type conductivity, which hinders the improvement of withstand voltage in power semiconductor devices due to difficulties in forming high-quality p-type semiconductors with suitable properties.

Innovation Solution

A power semiconductor device is designed with an n-type semiconductor layer made of a wide-gap material and a p-type semiconductor layer of a different material, either microcrystalline or amorphous structure, allowing for the formation of a stable pn junction that enhances withstand voltage without being constrained by the crystal structure or shape of the n-type layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a pn junction structure is used to improve withstand voltage, then the reverse withstand voltage increases, but it becomes difficult to achieve p-type conductivity in wide-gap semiconducting materials

Engineering Contradiction:
Improvereverse withstand voltageVSAvoidp-type conductivity formation
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent uses a composite structure where the first semiconductor layer is made of a wide-gap semiconducting material (such as Ga2O3, SiC, or GaN) and the second semiconductor layer is made of a different semiconducting material that can be easily doped to form a pn junction. This composite approach allows the device to achieve both high reverse withstand voltage (from the wide-gap material) and functional p-type conductivity (from the second material), resolving the contradiction between reliability and ease of manufacture.

Inventive Principle:
Principle #40Composite materials

2Reliability

If a guard ring structure or field limiting ring structure is used to increase withstand voltage, then the reverse withstand voltage improves, but the device complexity increases

Engineering Contradiction:
Improvereverse withstand voltageVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the p-type conductivity requirement from the wide-gap semiconducting material itself and implements it in a separate second semiconductor layer. This allows the first layer to maintain its simple, high-performance wide-gap structure while the second layer provides the necessary pn junction functionality, thereby reducing overall device complexity while maintaining high withstand voltage.

Inventive Principle:
Principle #2Taking out (Extraction)

3Stability of the object's composition

If the p-type semiconductor layer is made of the same wide-gap material as the n-type layer, then material consistency is maintained, but the quality and properties of p-type semiconductor are insufficient

Engineering Contradiction:
Improvematerial consistencyVSAvoidp-type semiconductor quality
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent applies local quality by using different materials for different functional layers: the first layer uses wide-gap material optimized for high breakdown voltage, while the second layer uses a different semiconducting material optimized for p-type conductivity. This localized material selection allows each layer to perform its specific function optimally, resolving the contradiction between material consistency and p-type semiconductor quality.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables the selection of materials for p-type conductivity that are not limited by the properties of the wide-gap semiconducting material, stabilizing the heterojunction and improving the withstand voltage of the power semiconductor device while reducing leakage current.

Implementation Method 1

A pn junction is formed on the n-type semiconductor layer

Methodology Applied
Scientific Effectpn junction:

Implementation Method 2

stabilizing the heterojunction and improving the withstand voltage

Methodology Applied
Scientific Effectheterojunction:

Implementation Method 3

an anode electrode that is provided on the n-type gallium oxide layer and forms a Schottky junction with the n-type gallium oxide layer

Methodology Applied
Scientific EffectSchottky junction:

Data Source

PatentUS11222985B2Power semiconductor device
Publication Date: 2022.01.11 MITSUBISHI ELECTRIC CORP
  • US11222985B2 patent drawing
  • US11222985B2 patent drawing
  • US11222985B2 patent drawing

AI summary

An n-type semiconductor layer has a single-crystal structure and is made of a wide-gap semiconducting material. A p-type semiconductor layer is provided on the n-type semiconductor layer and made of a material different from the aforementioned wide-gap semiconducting material, and has either a microcrystalline structure or an amorphous structure. An electrode is provided on at least one of the n-type semiconductor layer and the p-type semiconductor layer.