Power Semiconductor Module Dual-Sided Heat Dissipation
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Solution Overview
Problem
Conventional power semiconductor modules with increased capacity face challenges in cooling performance due to high thermal resistance, leading to increased costs and complexity, especially when multiple semiconductor elements are involved.
Innovation Solution
A power semiconductor module design featuring a resin-sealed structure with a lead frame for electrode bonding, an insulating substrate, and a molding resin that allows for dual-sided heat dissipation without additional insulating members, reducing manufacturing steps and costs while enhancing cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipating plates are placed on both surfaces of semiconductor elements with spacers, then cooling performance is improved, but part count and manufacturing complexity increase
Solution Approach 1:
The insulating substrate integrates multiple functions: it serves as an insulating member, a heat dissipating plate, and a mounting base for electrodes. This consolidation eliminates the need for separate spacers and multiple heat dissipating plates, reducing part count while maintaining dual-sided heat dissipation capability
Solution Approach 2:
The insulating substrate is designed to perform multiple functions simultaneously: electrical insulation, heat dissipation, and mechanical support. This multi-functionality allows a single component to replace what would traditionally require multiple separate parts, simplifying the overall structure
2Temperature
If multiple spacers and heat dissipating plates are used for multiple semiconductor elements, then cooling performance is improved, but manufacturing cost increases
Solution Approach 1:
By merging the functions of spacers, insulating members, and heat dissipating plates into a single insulating substrate, the number of components requiring procurement, inventory management, and assembly is reduced, directly lowering manufacturing costs
3Ease of manufacture
If conventional cooling structure with single cooler is used, then manufacturing is simple, but cooling performance is insufficient for high capacity modules
Solution Approach 1:
The cooling function is segmented into two independent heat dissipation paths: one through the insulating member from the first chip surface, and another through the insulating substrate from the second chip surface. This segmentation enables dual-sided cooling without complicating the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high cooling performance by dual-sided heat dissipation and simplifies manufacturing, reducing costs and part count, and ensures effective insulation between semiconductor elements and coolers.
Implementation Method 1
a heat spreader having conductivity, to which the first chip main surfaces of the plurality of semiconductor chips are bonded with a first bonding member
Implementation Method 2
The molding resin seals the at least one unit structure and the plurality of electrodes
Data Source
AI summary
First chip main surfaces of first semiconductor chips are bonded to a heat spreader, and second chip main surfaces of the first semiconductor chips are bonded to a first electrode. First chip main surfaces of second semiconductor chips are bonded to a heat spreader, and second chip main surfaces of the second semiconductor chips are bonded to a first electrode. A plurality of electrodes are provided by a lead frame. An insulating member is provided on a side opposite to the chips when viewed from the heat spreader. An insulating substrate is provided on a side opposite to the chips when viewed from the first electrodes.