Power Semiconductor Module Dual-Surface Conductor Patterns
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Solution Overview
Problem
Conventional power semiconductor modules face challenges in miniaturization and heat dissipation due to the stacking of multiple layers and the inefficiency in current path design, which affects inductance and thermal conductivity.
Innovation Solution
The power semiconductor module features conductor patterns on both surfaces of an insulating substrate with power semiconductor elements mounted on them, where the current flows in opposite directions, reducing inductance and utilizing a single insulating layer for heat dissipation, allowing for miniaturization and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductor patterns are formed only on one surface of the insulating substrate, then the manufacturing process is simpler, but the current path length increases leading to higher inductance
Solution Approach 1:
The patent extends the conductor patterns from a single surface to both surfaces of the insulating substrate. This dimensional transition allows the current path to utilize the third dimension (substrate thickness) to create a shorter, more direct current path between anode and cathode terminals, thereby reducing inductance while maintaining manufacturing feasibility through standard PCB fabrication techniques.
2Device complexity
If multiple layers are stacked to reduce current path length, then inductance decreases, but the module height increases and miniaturization becomes difficult
Solution Approach 1:
Instead of stacking multiple layers in the vertical direction (increasing module height), the patent utilizes both surfaces of a single insulating substrate to create short current paths. This approach reduces inductance by optimizing the current path layout on the available surfaces without increasing the module height, enabling miniaturization.
Solution Approach 2:
The patent divides the current path into segments that flow on the front surface, traverse through the substrate edges, and continue on the back surface. This segmentation allows the current to follow an optimized path that minimizes inductance while keeping the overall module compact and avoiding height increase through layer stacking.
3Reliability
If heat-dissipating metals are positioned away from the circuit for insulation, then electrical isolation is achieved, but heat dissipation efficiency decreases
Solution Approach 1:
The patent uses the insulating substrate itself as an intermediary element. The substrate provides both electrical isolation and thermal conduction pathways. By forming conductor patterns on both surfaces and utilizing the substrate's inherent insulation properties, the design achieves electrical isolation while maintaining efficient heat dissipation through the substrate and to the heat-dissipating metals positioned at the periphery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces inductance, enables miniaturization by dividing the circuit area between both substrate surfaces, and enhances heat dissipation by positioning heat-dissipating metals closer to the circuit, resulting in a more compact and efficient power semiconductor module.
Implementation Method 1
conductor patterns formed on both surfaces of the insulating substrate... a current that flows between the anode terminal connection portion and the cathode terminal connection portion via the power semiconductor element flows on the both surfaces of the insulating substrate
Implementation Method 2
the conductor pattern on a surface opposite to the one surface is connected to the heat-dissipating metal via an insulating layer... enhances heat dissipation by positioning heat-dissipating metals closer to the circuit
Data Source
AI summary
A power semiconductor module includes an insulating substrate, conductor patterns and a power semiconductor element. The conductor patterns are formed on both surfaces of the insulating substrate. The power semiconductor element is mounted on the conductor patterns. The conductor patterns include an anode terminal connection portion and a cathode terminal connection portion. A circuit is formed such that a current that flows between the anode terminal connection portion and the cathode terminal connection portion via the power semiconductor element flows on the both surfaces of the insulating substrate.