Power Semiconductor Module Frame Case Concaved Parts Fixation
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Solution Overview
Problem
The power semiconductor module requires a strict dimensional accommodating space for uniform cooling of the circuit unit and heat sink, but existing methods struggle to fix the case securely without expanding its size due to limited peripheral width, leading to potential displacement during joining.
Innovation Solution
A power semiconductor module design featuring a metal case with a frame case and metal base, where the frame case has concaved parts on its side surfaces to securely fix the metal base without expanding the module's size, using friction stir welding for joining, ensuring accurate positioning and efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the width of the peripheral part of the opening part of the metal frame object is increased to fix the case securely, then the fixation reliability is improved, but the size of the power semiconductor module is expanded
Solution Approach 1:
The invention transitions from fixing the case in the planar direction (width of peripheral part) to fixing it in the thickness direction by forming concaved parts that extend inward from the side surfaces. This dimensional shift allows secure fixation without increasing the module's external dimensions.
Solution Approach 2:
The frame case is divided into multiple side surfaces, each with concaved parts that can independently engage with the metal base. This segmentation allows distributed fixation points that provide reliable positioning without requiring a large overall peripheral width.
2Volume of moving object
If the width of the peripheral part of the opening part of the metal frame object is kept small to maintain compact size, then the module size is reduced, but the case cannot be fixed securely leading to potential displacement
Solution Approach 1:
Instead of relying on planar width for fixation, the invention uses the thickness direction by forming concaved parts that extend inward. This allows compact module size while achieving secure fixation through the vertical engagement of the metal base with the concaved parts.
Solution Approach 2:
The metal base is inserted into and nested within the frame case structure, with the concaved parts providing internal engagement features. This nesting arrangement secures the case without requiring additional external space.
3Ease of manufacture
If the case is not fixed securely during joining, then the manufacturing process is simpler, but the position of the case changes leading to poor cooling performance
Solution Approach 1:
The concaved parts are pre-formed in the frame case before the joining process. These pre-formed features automatically guide and position the metal base during assembly, ensuring precise positioning without complex fixation mechanisms or complex joining procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for satisfactory cooling of the circuit unit without increasing the module's size, ensuring precise fixation and preventing deformation during the joining process, thus enhancing thermal management and structural integrity.
Implementation Method 1
joining a matching part of the heat sink and the peripheral part of the opening part of the metal frame object by friction stir welding
Data Source
AI summary
An object of the present invention is to provide a power semiconductor module that can secure a satisfactory cooling without expanding the size of a case component. In the power semiconductor module according to the present invention, a frame case includes a front surface, a back surface, and a pair of side surfaces and formed with an opening part in at least one of the front surface and the back surface. A metal base is inserted into the opening part of the frame case. A frame case is provided with a joining part FW to which the peripheral part of the metal base and the peripheral part of the opening part of the frame case are joined. A first concaved part and a second concaved part are formed respectively in each of a pair of side surfaces of the frame case. Each of the concaved parts is prolonged toward an inner side of the frame case from the side surfaces, and includes a bottom surface formed facing the joining part FW side in an intermediate position of the thickness direction of each of the side surfaces.