Power Semiconductor Module Housing with Pressing Die
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Solution Overview
Problem
Modern power semiconductor modules without a base plate face challenges in efficient heat transfer to a heat sink due to difficulties in controlling solder connections, which affects reliability and service life, and require simplified assembly processes.
Innovation Solution
A power semiconductor module design featuring a ceramic substrate with a metal layer, an insulating plastic housing, and a hood with a pressing die that elastically pre-stresses the substrate against the heat sink, ensuring efficient heat transfer and simplified assembly by eliminating the need for additional fastening means between the frame and heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder connections are used to connect the substrate to the heat sink, then thermal connection is established, but controlling quality is difficult which adversely affects reliability and service life
Solution Approach 1:
The patent replaces the soldering process (thermal-chemical connection) with a mechanical pressure contact system. The housing pressurizes the substrate against the heat sink through integrated pressing dies, creating a reliable mechanical connection that is easier to control and ensures consistent thermal contact without the quality control issues of soldering.
Solution Approach 2:
The housing serves multiple functions: it protects components, provides electrical insulation, and actively pressurizes the substrate against the heat sink through integrated pressing dies. This self-service mechanism ensures reliable thermal contact without requiring separate fastening operations or complex soldering processes.
2Ease of manufacture
If pressure contact assembly technology is used for thermal connection, then assembly is simplified, but it is difficult to adjust pressure introduction which may damage the substrate or fail to establish reliable contact-connection
Solution Approach 1:
The pressing dies are pre-formed as integral parts of the housing structure, with their geometry and positioning predetermined during housing manufacturing. This preliminary action ensures that when the housing is assembled, the correct pressing force is automatically applied to the substrate without requiring complex adjustment mechanisms during the assembly process.
Solution Approach 2:
The patent optimizes the geometric parameters of the pressing dies (size, shape, positioning) to achieve the desired pressing force. By carefully designing these parameters during the housing manufacturing stage, the system achieves reliable contact pressure without risking substrate damage, eliminating the need for post-assembly adjustments.
3Reliability
If the module requires additional fastening means between frame and heat sink, then secure connection is achieved, but assembly process becomes more complex
Solution Approach 1:
The patent merges the housing structure with the pressing mechanism by integrating pressing dies directly into the housing. This combination eliminates the need for separate fastening components between the frame and heat sink, as the housing itself provides both structural support and pressing force, thereby simplifying the assembly process while maintaining secure connection.
Solution Approach 2:
The housing performs multiple functions simultaneously: it provides mechanical protection for internal components, ensures electrical insulation, and creates thermal contact with the heat sink through integrated pressing dies. This multi-functionality eliminates the need for additional dedicated fastening components, reducing assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat transfer efficiency and simplifies assembly, reducing the risk of mechanical damage to the substrate while ensuring reliable thermal connection and preassembly for faster installation.
Implementation Method 1
Heat transfer between the substrate and the heat sink is a key variable for power semiconductor modules which directly determines the performance of said power semiconductor modules
Implementation Method 2
the hood has at least one pressing die which is intended to make contact with the substrate in order to pre-stress the substrate elastically against the heat sink
Data Source
AI summary
A power semiconductor module includes a substrate having a first side for being arranged to face a heat sink and for being thermally conductively connected to the heat sink, a power semiconductor component arranged on an opposing second side of the substrate, and an electrically insulating housing defining a cavity in which the substrate and the power semiconductor component are accommodated. The housing includes a frame which surrounds the substrate in a frame-like manner, and a hood for being fastened to the heat sink by way of fastening means. The hood includes a pressing die for making contact with the substrate so as to pre-stress the substrate elastically against the heat sink by means of the hood and the pressing die at least when the power semiconductor module is fastened on the heat sink. The frame accommodates the substrate in an interlocking manner and/or is fastened to the substrate.