Power Semiconductor Module Low Inductance Layout
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Solution Overview
Problem
Existing power semiconductor modules have a high space requirement due to their high inductance, which limits their compactness and efficiency.
Innovation Solution
A power semiconductor module design featuring electrically conducting intermediate and AC potential rails with packaged power semiconductor switches, contact springs, and strategically placed capacitors to reduce inductance and enhance mechanical symmetry, along with metal layers for reliable electrical connections, allowing for a compact and efficient layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power semiconductor modules are designed with conventional layouts to achieve low inductance, then the inductance is reduced, but the space requirement increases
Solution Approach 1:
The control terminals are arranged in the third dimension by projecting them perpendicularly from the AC potential rail surface, allowing control connections to be made without increasing the planar footprint. This vertical arrangement enables low-inductance connections while maintaining a compact two-dimensional layout.
Solution Approach 2:
The control terminals are integrated into the existing rail structure by projecting from the AC potential rail, effectively nesting the control function within the power transmission infrastructure. This eliminates the need for separate control terminal arrangements that would increase footprint.
2Device complexity
If control terminals are arranged on the same plane as power terminals, then the layout is simplified, but the inductance increases
Solution Approach 1:
The control terminals are positioned in the third dimension perpendicular to the rail surface, creating a vertical separation between power terminals (on the surface) and control terminals (projecting upward). This spatial separation reduces the loop area for control signals, thereby reducing inductance while maintaining layout simplicity.
3Ease of manufacture
If asymmetric arrangement of control terminals is used, then manufacturing is simplified, but mechanical symmetry and vibration resistance are reduced
Solution Approach 1:
The invention actually applies symmetry by arranging control terminals in opposite directions from the AC potential rail. This symmetric configuration balances mechanical stresses and improves vibration resistance, while the standardized projection method maintains manufacturing simplicity.
Data Source
AI summary
A power semiconductor module has a first and second intermediate circuit rail, an AC potential rail and with a packaged first and second power semiconductor switch. The respective power semiconductor switch has a first and second load current terminal and a control terminal, wherein the first power semiconductor switch is between the first intermediate circuit rail and the AC potential rail and the second power semiconductor switch is between the second intermediate circuit rail and the AC potential rail. The first load terminal of the first power semiconductor switch is contacted to the first intermediate circuit rail and the second load terminal of the first power semiconductor switch is electrically conductively contacted to the AC potential rail.