Power Semiconductor Module Mounting Arrangement
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Solution Overview
Problem
Power semiconductor module arrangements face mechanical damage due to internal tension caused by the different coefficients of thermal expansion between encapsulation materials and other elements, and they often fail to meet creepage distance requirements.
Innovation Solution
A power semiconductor module arrangement with a mounting arrangement comprising a frame or body, a first terminal element, and a second terminal element, where the first terminal element is injected into and inextricably coupled to the frame or body, and the second terminal element is detachably coupled within a hollow space, providing dielectric insulation and reducing the thickness of the encapsulation material to minimize tension and stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the housing is filled with encapsulation material to protect elements and provide dielectric insulation, then protection and insulation are improved, but internal tension builds up due to different coefficients of thermal expansion causing mechanical damage
Solution Approach 1:
The patent extracts the encapsulation material from the housing cavity, replacing it with a mounting arrangement that provides protection and insulation through alternative means (terminal elements with dielectric coatings and structured housing design) rather than filling the entire space with encapsulation material, thereby eliminating the source of thermal expansion stress
Solution Approach 2:
The patent changes the physical state and distribution of protective materials by transitioning from a bulk encapsulation material filling the housing to localized dielectric coatings on terminal elements and selective positioning of semiconductor components, altering how protection and insulation are achieved without uniform thermal expansion constraints
2Ease of operation
If terminal elements are used to contact the semiconductor arrangement from outside the housing, then electrical connection is improved, but creepage distance requirements are not met
Solution Approach 1:
The patent introduces dielectrically coated terminal elements as intermediaries between the conductive semiconductor components and the external environment, where the dielectric coating serves as a mediator that provides both electrical connection functionality and creepage distance compliance through its insulating properties
Solution Approach 2:
The terminal elements are constructed as composite structures combining conductive materials (for electrical connection) with dielectric coatings (for insulation and creepage distance), creating a multi-material solution that simultaneously satisfies both electrical and insulation requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces mechanical damage and meets creepage distance requirements by minimizing the encapsulation material thickness, thereby reducing internal tension and stress within the power semiconductor module.
Implementation Method 1
The first terminal element is injected into and inextricably coupled to the frame or body
Data Source
AI summary
A power semiconductor module arrangement includes: a housing; first and second electrical contacts within the housing; and a mounting arrangement including a frame or body and first and second terminal elements. The mounting arrangement is inserted in and coupled to the housing. First ends of the first and second terminal elements mechanically and electrically contact the first and second electrical contacts, respectively. A middle part of each terminal element extends through the frame or body. A second end of each terminal element extends outside the housing. The first terminal element is dielectrically insulated from the second terminal element by a portion of the frame or body. The first terminal element is injected into and inextricably coupled to the frame or body. The second terminal element is arranged within a hollow space inside the frame or body and is detachably coupled to the frame or body.