Power Semiconductor Module Series Connection Design

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Solution Overview

Problem

Existing power semiconductor modules lack versatility in application to various power converting apparatuses for railroad vehicles, requiring complex circuit configurations when combining multiple modules.

Innovation Solution

A power semiconductor module design featuring a core module with antiparallel connected diode and switching elements, sealed by resin, and a cover with exposed electrodes for series connection, allowing for flexible configuration and high withstanding voltage specifications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a power semiconductor module uses a conventional configuration with separate modules for different voltage specifications, then each module can be optimized for its specific application, but the overall system complexity increases and versatility decreases

Engineering Contradiction:

Improveversatility in application to various power converting apparatusesVSAvoidcircuit configuration complexity when combining multiple modules

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a power semiconductor module with a standardized core module configuration that can be universally applied to different voltage specifications (100V, 200V, 400V, 800V) through series connection of multiple identical modules, eliminating the need for separate optimized designs for each voltage level and reducing system complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If power semiconductor modules are designed for high withstanding voltage specifications, then the module can handle higher voltage applications, but the manufacturing complexity and cost increase

Engineering Contradiction:

Improvewithstanding voltage specificationVSAvoidmanufacturing cost and complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by dividing high voltage power semiconductor modules into smaller core module units that can be series-connected to achieve the desired voltage rating. This allows standardization of the core module design for easier manufacturing while achieving high voltage capabilities through modular assembly, reducing both manufacturing complexity and cost

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent combines multiple identical core modules in series to achieve high withstanding voltage specifications. This merging approach maintains manufacturing simplicity by using repeated standardized units rather than designing complex single-unit high voltage modules, thereby reducing manufacturing cost while achieving the required voltage rating

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10312227B2Power semiconductor module

Publication Date: 2019.06.04 MITSUBISHI ELECTRIC CORP

AI summary

First and second element pairs formed by connecting FWDs and MOSFETs in antiparallel are connected in series and sealed by resin to configure a core module. In the core module, a first drain electrode, a first source electrode, a second drain electrode, and a second source electrode are exposed to the surface. A cover with terminals is put on the core module. At this time, each of the direct-current positive electrode terminal, the direct-current negative electrode terminal, and the alternating-current terminal of the cover with terminals is electrically connected to each of the first drain electrode, the second source electrode, and the first source electrode and the second drain electrode.