Power Semiconductor Module Terminal Block Design
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Solution Overview
Problem
Conventional power semiconductor modules face issues with thermal loading, mechanical stress, and high inductance due to terminal plates or pins, leading to potential damage and switching faults, as well as complex and space-consuming electrical connections.
Innovation Solution
A power semiconductor module design featuring electrically conductive terminal blocks with screw threads and connecting conductors that provide a firm and low-inductance connection to the circuit carrier and semiconductor component, allowing for straightforward assembly and reduced mechanical stress, using materials like copper alloys and ceramic substrates for insulation and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If terminal plates are used for electrical contacting, then electrical terminals can be provided for external contacting, but strong thermal loading occurs during soldering which may damage the circuit carrier and/or electrical components
Solution Approach 1:
The invention extracts the problematic terminal plate component and replaces it with a terminal pin that can be directly soldered to the circuit carrier without requiring high-temperature soldering of large mass components. The terminal pin's small size and direct connection eliminate the thermal mass issue while maintaining electrical contacting functionality.
Solution Approach 2:
The invention introduces an intermediary approach by using a terminal pin that serves as a direct connector between the circuit carrier and external connections, eliminating the need for large terminal plates that cause thermal issues. The terminal pin acts as a mediator that provides electrical contact without the thermal loading problem.
2Reliability
If terminal plates are used for electrical contacting, then electrical terminals are provided, but high inductances occur which lead to switching faults in controllable semiconductor switches
Solution Approach 1:
The invention removes the terminal plate structure that generates high inductance and replaces it with a terminal pin that provides a direct, low-inductance path for current flow. This extraction of the problematic component eliminates the inductance-related switching faults while maintaining the electrical contacting function.
3Temperature
If single terminal pins are used instead of terminal plates, then thermal loading is reduced, but great outlay is required for precise positioning and alignment of the second ends with contact openings of the printed circuit board
Solution Approach 1:
The invention merges the terminal pin positioning with the module housing structure by integrating guiding elements and alignment features directly into the housing. This combination eliminates the need for separate, elaborate positioning operations while maintaining the thermal advantages of terminal pins.
Solution Approach 2:
The invention performs preliminary positioning actions by pre-aligning the terminal pins with the module housing structure during module assembly. The housing is designed with built-in alignment features that automatically position the terminal pins correctly, eliminating the need for subsequent elaborate alignment operations with the printed circuit board.
4Temperature
If single terminal pins are used, then thermal loading is reduced, but high forces are transmitted via the terminal pins onto the circuit carrier which cause mechanical stress and may damage the circuit carrier
Solution Approach 1:
The invention segments the mechanical load path by introducing a terminal block as an intermediate structure that distributes the mounting forces across multiple attachment points. Instead of concentrating forces on the circuit carrier through terminal pins, the terminal block absorbs and distributes these forces, protecting the circuit carrier from mechanical damage while maintaining the thermal benefits of pin-based connections.
5Reliability
If terminal blocks with screw threads are used, then secure electrical connections are achieved, but more space is required inside the module housing for connecting lines
Solution Approach 1:
The invention implements nesting by integrating the terminal block structure directly into the module housing, with the terminal block and connecting lines nested within the housing volume. This nested arrangement minimizes the space required for electrical connections while maintaining secure electrical contact through the terminal block's screw thread interface.
Data Source
AI summary
A power semiconductor module includes a module housing and a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied onto an upper side of the dielectric insulation carrier. A semiconductor component is arranged on the circuit carrier. The power semiconductor module also has an electrically conductive terminal block connected firmly and electrically conductively to the circuit carrier and/or to the semiconductor component. The terminal block has a screw thread that is accessible from an outer side of the module housing. A method for producing such a power semiconductor module is also provided.