Power Semiconductor Module Terminal Segmentation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Power semiconductor module arrangements face challenges in achieving improved switching characteristics, particularly in meeting creepage distance requirements and optimizing terminal positioning for efficient electrical connections.

Innovation Solution

The power semiconductor module arrangement includes a housing with strategically positioned terminals grouped by electrical potential, with each group located in distinct sections to minimize voltage drops and optimize conductor track lengths, featuring a first switching element and a second switching element connected in series between supply nodes and an output node, with auxiliary emitter terminals for reduced feedback effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If terminals are positioned to optimize electrical connections and minimize voltage drops, then switching characteristics are improved, but creepage distance requirements may not be met

Engineering Contradiction:
Improveswitching characteristicsVSAvoidcreepage distance compliance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The housing is divided into three distinct sections along the longitudinal direction: a first section for first terminals (first electrical potential), a second section for second terminals (second electrical potential), and a third section for third terminals (output potential) and control terminals. This segmentation spatially separates terminals of different potentials, ensuring adequate creepage distances while optimizing electrical connections within each section.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional terminal arrangement to a three-dimensional sectional layout within the housing. By organizing terminals into distinct longitudinal sections (first section, second section, third section), the design achieves both compactness and adequate creepage distances through spatial distribution in the longitudinal dimension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of energy

If terminals of the same electrical potential are positioned close together to minimize conductor track lengths, then voltage drops are reduced, but creepage distance requirements may be compromised

Engineering Contradiction:
Improvevoltage dropsVSAvoidcreepage distance
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

Terminals of the same electrical potential are grouped together in the same housing section: all first terminals (first electrical potential) in the first section, all second terminals (second electrical potential) in the second section, and all third terminals (output potential) in the third section. This equipotential grouping minimizes conductor track lengths and voltage drops while the sectional separation ensures creepage distance compliance.

Inventive Principle:
Principle #12Equipotentiality

3Volume of moving object

If the housing layout is optimized for compactness, then device size is reduced, but terminal positioning for optimal switching characteristics becomes difficult

Engineering Contradiction:
Improvehousing sizeVSAvoidswitching characteristics
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The housing is segmented into three compact longitudinal sections, each containing terminals of the same electrical potential. This segmentation enables a compact overall housing design while maintaining optimal terminal positioning within each section for minimized conductor track lengths and improved switching characteristics.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11107739B2Power semiconductor module arrangement
Publication Date: 2021.08.31 INFINEON TECHNOLOGIES AG
  • US11107739B2 patent drawing
  • US11107739B2 patent drawing
  • US11107739B2 patent drawing

AI summary

A power semiconductor module arrangement includes a first switching element and a second switching element, each having a control terminal and a controllable load path between two load terminals, the load paths being operatively coupled in series and between a first supply node, and a second supply node. The switching elements are connected with each other via a first common node. An output node configured to be coupled to an output potential is coupled to the first common node. The first supply node is formed by a plurality of first terminals, the second supply node is formed by a plurality of second terminals, and the output node is formed by a plurality of third terminals. The switching elements are arranged inside a housing.