Power Semiconductor Package External Control Powering

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Solution Overview

Problem

Power semiconductor packages in automotive electronics experience inefficiencies leading to increased fuel consumption and emissions, necessitating improved efficiency in these components.

Innovation Solution

The development of power semiconductor packages with integrated controllers that utilize a potential difference between reference and supply voltage terminals to power control circuits, eliminating the need for an internal power source and reducing voltage drops in multiphase rectifiers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If power semiconductor packages include internal power sources to power control circuits, then control functionality is enabled, but device complexity and loss of energy increase

Engineering Contradiction:
Improvecontrol functionalityVSAvoidpackage structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The invention extracts the power source function from the power semiconductor package itself and relocates it to the external circuit. The control circuit is powered by taking power from the potential difference between the reference potential terminal and supply voltage terminal in the external circuit, rather than including an internal power source in the package. This reduces package complexity while maintaining control functionality.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention makes the external circuit serve multiple functions: it provides both the power supply voltage and the reference potential, creating a potential difference that powers the control circuit. This multi-functional use of external circuit elements eliminates the need for separate internal power sources in the package.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of operation

If internal power sources are included in power semiconductor packages, then control circuits can be powered, but voltage drops increase in multiphase rectifiers

Engineering Contradiction:
Improvecontrol circuit operationVSAvoidvoltage drops
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The invention extracts the power source function from internal package components and relocates it to external circuit elements. By powering the control circuit from the potential difference between external terminals rather than internal batteries or power sources, the invention eliminates additional voltage drops that would be introduced by internal power conversion circuits.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention uses the potential difference between the reference potential terminal and supply voltage terminal as an intermediary power source. This external voltage difference serves as a mediator to power the control circuit without requiring additional internal power conversion stages that would introduce voltage drops and energy losses.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If conventional power semiconductor packages are used in automotive electronics, then basic power conversion is achieved, but fuel consumption and emissions increase due to inefficiencies

Engineering Contradiction:
Improvepower conversion functionVSAvoidfuel consumption
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The invention converts the existing potential difference in the external circuit, which would otherwise be unused or wasted, into a useful power source for the control circuit. By utilizing this existing voltage difference rather than adding internal power sources, the invention reduces energy losses and improves overall system efficiency, thereby reducing fuel consumption and emissions in automotive applications.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS10516343B2Power semiconductor package and applications
Publication Date: 2019.12.24 INFINEON TECHNOLOGIES AG
  • US10516343B2 patent drawing
  • US10516343B2 patent drawing
  • US10516343B2 patent drawing

AI summary

A power semiconductor package includes a reference voltage terminal, a supply voltage terminal, a phase terminal, a first power transistor and a second power transistor. The first power transistor and the second power transistor are connected in series and form a low side switch and a high side switch of a half bridge circuit.