Power Semiconductor Package Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in power semiconductor device manufacturing lies in packaging, where high thermal robustness, low cost, improved heat dissipation, and increased reliability are needed to enhance performance, but current methods are cost-intensive and inefficient in heat removal.
Innovation Solution
The use of a soft covering material with a lower elastic modulus and higher thermal conductivity than conventional mold materials, applied selectively to embed power semiconductor chips, which enhances heat removal and reduces stress on the chip and package connections, allowing for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional mold materials are used to embed power semiconductor chips, then manufacturing cost is reduced, but heat dissipation capability and thermal robustness deteriorate
Solution Approach 1:
The patent changes the material parameters by using a soft covering material with lower elastic modulus and higher thermal conductivity compared to conventional mold materials. This material substitution directly improves heat dissipation capability while maintaining manufacturing feasibility, resolving the contradiction between cost and thermal performance.
Solution Approach 2:
The patent employs a composite structure where a soft covering material is applied over the power semiconductor chip within the mold material. This composite approach combines the protective and insulating properties of the mold material with the superior thermal conductivity and stress-absorbing properties of the soft covering material, achieving both cost-effectiveness and improved heat dissipation.
2Device complexity
If conventional mold materials are used to embed power semiconductor chips, then manufacturing simplicity is maintained, but reliability and electrical performance deteriorate
Solution Approach 1:
The patent modifies the material parameters by introducing a soft covering material with optimized elastic modulus and thermal conductivity properties. This change enhances reliability and electrical performance through improved stress distribution and heat management, while the material can be integrated into existing manufacturing processes to maintain simplicity.
Solution Approach 2:
The soft covering material is applied selectively in specific regions where stress concentration and heat generation occur most intensely. This localized application targets the critical areas needing enhanced reliability without requiring complete redesign of the manufacturing process, thus maintaining manufacturing simplicity while improving performance.
3Temperature
If additional substances like thermal grease are used to improve heat dissipation, then thermal performance improves, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the functions of the mold material and the soft covering material into a unified structure where the soft covering material is integrated directly into the package assembly. This eliminates the need for separate thermal grease applications and reduces manufacturing steps, as the soft covering material provides both structural and thermal management functions simultaneously.
Solution Approach 2:
The patent extracts the thermal grease function entirely by replacing it with the soft covering material that provides inherent thermal conductivity. This eliminates the need for additional thermal interface substances and their associated application steps, reducing device complexity while maintaining or improving thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation capabilities, reduces thermal resistance, and increases the reliability and performance of power semiconductor packages by providing a more effective thermal interface without the need for additional substances like thermal grease.
Implementation Method 1
a soft covering material with a lower elastic modulus and higher thermal conductivity than conventional mold materials, applied selectively to embed power semiconductor chips, which enhances heat removal
Implementation Method 2
a soft covering material with a lower elastic modulus and higher thermal conductivity than conventional mold materials, applied selectively to embed power semiconductor chips, which enhances heat removal and reduces stress on the chip and package connections
Data Source
AI summary
A method of manufacturing a semiconductor power package includes: embedding a power semiconductor chip in an encapsulation, the encapsulation forming a housing of the semiconductor power package; and extending a layer of a covering material over at least a part of an outer main surface of the encapsulation. The covering material has a thermal conductivity greater than a thermal conductivity of the material of the encapsulation and/or a temperature stability greater than a temperature stability of the pre-molded chip housing.