Power Semiconductor Pin Sealing via Elastic Deformation
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Solution Overview
Problem
Existing power semiconductor devices face challenges in reliably preventing the ingress of dirt and moisture into their housings, which can compromise their long-term performance and reliability.
Innovation Solution
A power semiconductor device design featuring a pin element with a thread, a support device, an elastic sealing device, and a pressure device, where the sealing device is formed from crosslinked silicone, and the sleeve is designed with recesses to ensure reliable sealing and mechanical stability, with the pin element being rotationally fixed to a holding body for enhanced connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electrical connection elements are sealed off from the housing wall, then the ingress of particles of dirt and moisture is prevented, but the sealing reliability deteriorates over time
Solution Approach 1:
The sealing device is divided into multiple sealing elements (first sealing element and second sealing element) that are arranged at different locations along the pin element. This segmentation allows each sealing element to independently perform sealing functions at critical interfaces, ensuring comprehensive sealing without compromising reliability over time.
Solution Approach 2:
The elastic sealing device acts as an intermediary element between the pin element and the housing wall. This intermediary component provides a flexible sealing interface that maintains effective sealing even under varying thermal and mechanical conditions, preventing both dirt/moisture ingress and sealing degradation over time.
2Object-affected harmful factors
If a sealing device is added to prevent dirt and moisture ingress, then sealing effectiveness is improved, but the device complexity increases
Solution Approach 1:
The pin element serves multiple functions: it provides mechanical support for the electrical connection element, acts as a mounting structure for the sealing device, and serves as a thread element for electrical connection. This multi-functionality reduces the need for separate dedicated sealing components, maintaining sealing effectiveness while minimizing device complexity.
Solution Approach 2:
The sealing device is integrated into the existing pin element structure, with sealing elements arranged around the pin element in a nested configuration. This nesting approach allows the sealing function to be incorporated within the existing structural framework, improving sealing effectiveness without significantly increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the ingress of dirt and moisture, ensuring long-term reliability and stability of the power semiconductor device by creating a robust sealing mechanism that maintains electrical conductivity and mechanical integrity.
Implementation Method 1
the first pressure element (60a) is designed to press the first sealing element (6a) against the first support element (50a) in the axial direction (B) of the pin element (7) and in this way to cause deformation of the first sealing element (6a) in such a way that the first sealing element (6a) presses against the housing opening wall (2a) and against the sleeve (5) in a perpendicular direction in relation to the axial direction (B) of the pin element (7)
Implementation Method 2
the sealing device (6) is formed from an elastomer, in particular from a crosslinked silicone, in particular from a crosslinked silicone rubber, since very reliable sealing off is achieved in this case
Data Source
AI summary
The invention relates to a power semiconductor device comprising a pin element which passes through a housing opening, comprising a support device, further comprising an elastic sealing device which is arranged on the support device, comprising a pressure device which is arranged on the sealing device, and comprising an electrically conductive sleeve. A first pressure element of the pressure device presses a first sealing element of the sealing device against a first support element of the support device in the axial direction of the pin element causes deformation of the first sealing element so that the first sealing element presses against the housing opening wall and against the sleeve in a perpendicular direction in relation to the axial direction of the pin element. A second pressure element of the pressure device is designed to press a second sealing element of the sealing device against a second support element of the support device in the axial direction of the pin element and in this way to cause deformation of the second sealing element in such a way that the second sealing element presses against the sleeve and against the pin element in a perpendicular direction in relation to the axial direction of the pin element.