Power Semiconductor Device with Embedded Planar Conductors
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Solution Overview
Problem
Conventional power semiconductor devices face limitations due to the use of bonding wires, which require a certain bonding loop height, making it difficult to reduce device package size, and complex production methods involving multiple components and films with conductor tracks.
Innovation Solution
A power semiconductor device with large-area power electrodes on both sides of the chip, connected to external contacts via patterned metal layers within a plastic package, eliminating the need for bonding wires and films, and allowing for variable metal layer thicknesses and layered construction for enhanced reliability and current handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If bonding wires are used to connect power semiconductor chips to external contacts, then electrical connection is achieved, but the device package size cannot be reduced due to required bonding loop height
Solution Approach 1:
The patent transitions from three-dimensional bonding wire connections (requiring vertical loop height) to two-dimensional planar conductor track connections within insulating films. This dimensional change eliminates the bonding loop height constraint, enabling compact package design while maintaining electrical connectivity between power semiconductor chips and external contacts.
Solution Approach 2:
The patent extracts and eliminates the bonding wire component from the assembly, replacing it with integrated conductor tracks formed within insulating films during the molding process. This removal of the bonding wire eliminates the associated space requirements and simplifies the overall device structure.
2Volume of moving object
If planar wiring structure with multiple insulating films and conductor tracks is used, then device package size is reduced, but production complexity increases due to multiple components requiring lamination and connection
Solution Approach 1:
The patent merges multiple separate components (insulating films, conductor tracks, and molding compound) into a single integrated molding compound that contains embedded conductor tracks. This consolidation eliminates the need for separate lamination and mechanical connection steps, significantly simplifying the production process while maintaining the compact planar wiring structure.
Solution Approach 2:
The molding compound serves multiple functions simultaneously: it provides electrical insulation, contains embedded conductor tracks for electrical connections, and acts as the structural packaging material. This multi-functionality eliminates the need for separate insulating films and simplifies both production and device structure.
3Power
If bonding wires are used for electrical connection, then current carrying capacity is limited by the wire gauge, but increasing wire thickness increases package size
Solution Approach 1:
The patent changes the geometric parameters of the conductor tracks within the molding compound, allowing flexible adjustment of track width and thickness to optimize current carrying capacity. This enables high current loading without increasing overall package size, as the conductor tracks can be made sufficiently thick within the planar structure without requiring additional vertical space.
Data Source
AI summary
A power semiconductor device and a method for its production. The power semiconductor device has at least one power semiconductor chip, which has on its top side and on its back side large-area electrodes. The electrodes are electrically in connection with external contacts by means of connecting elements, the power semiconductor chip and the connecting elements being embedded in a plastic package. This plastic package has a number of layers of plastic, which are pressed one on top of the other and have plane-parallel upper sides. The connecting elements are arranged on at least one of the plane-parallel upper sides, between the layers of plastic pressed one on top of the other, as a patterned metal layer and are electrically in connection with the external contacts by means of contact vias through at least one of the layers of plastic.