Power Semiconductor Module Pressure Device Design
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Solution Overview
Problem
Existing power semiconductor modules face limitations in applying pressure to internally circuit-conforming connections due to the limited area available, resulting in reduced current-carrying capacity and inefficient heat transfer.
Innovation Solution
A power semiconductor module design featuring a movable pressure device with a pressure body and elements that press onto a composite connecting device, allowing for force-fitting attachment to a cooling device, thereby distributing pressure effectively across a larger surface area and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If direct pressure is applied to power semiconductor components with wire bonded connections, then pressure can be applied to the component, but the area available for pressure application is limited and current-carrying capacity is reduced
Solution Approach 1:
The patent introduces a connecting device with a composite film structure (conductive and insulating layers) as an intermediary between the pressure device and the power semiconductor component. This intermediary allows pressure to be applied through a larger surface area while maintaining electrical connection, thus resolving the contradiction between applying pressure and maintaining adequate pressure application area without compromising current-carrying capacity.
Solution Approach 2:
The connecting device uses a composite film comprising both electrically conductive and electrically insulating films. This composite structure enables the device to simultaneously provide electrical connection (through the conductive layer) and electrical isolation (through the insulating layer), allowing pressure to be applied over a larger area while maintaining proper electrical functionality and current-carrying capacity.
2Force
If direct pressure is applied to power semiconductor components, then pressure can be applied to the component, but bonding connections cannot be established at the pressure point
Solution Approach 1:
The connecting device acts as an intermediary that distributes pressure across its surface while maintaining electrical connections through its conductive film structure. This allows pressure to be applied to the power semiconductor component without concentrating force at specific bonding points, thereby maintaining bonding connection reliability while achieving effective pressure application.
Solution Approach 2:
The connecting device utilizes thin film structures that can conform to the surfaces of the power semiconductor components and distribute pressure evenly. These flexible thin films maintain electrical connections while allowing pressure to be applied without damaging bonding connections, as the films can deform to accommodate the pressure distribution.
3Temperature
If a larger surface area is used for pressure application, then thermal efficiency can be improved, but the complexity of the pressure device increases
Solution Approach 1:
The connecting device serves multiple functions simultaneously: it provides electrical connection through its conductive film, electrical isolation through its insulating film, and thermal conduction through its thermally conductive paste. This multi-functionality allows a single device structure to achieve larger surface area contact for improved thermal efficiency without proportionally increasing device complexity.
Solution Approach 2:
The connecting device employs composite materials including thermally conductive paste in addition to the conductive and insulating films. This composite material approach enables the device to achieve improved thermal efficiency through larger contact area while maintaining a relatively simple overall structure, as the different material layers work together to provide multiple functions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables simple and effective pressure application, improving current-carrying capacity and thermal efficiency by allowing for a larger surface area contact and thin thermally conductive paste usage, optimizing heat transfer and module performance.
Implementation Method 1
distributing pressure effectively across a larger surface area
Implementation Method 2
enhancing thermal conductivity
Implementation Method 3
thin thermally conductive paste usage, optimizing heat transfer
Data Source
AI summary
A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.