Power Semiconductor Resin Anchoring via Sintered Metal Voids
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Solution Overview
Problem
The adhesion strength between a sintered metal compact and a resin in transfer-molded power semiconductor devices is insufficient, leading to detachment of the resin from the joining layer, which compromises the reliability and heat resistance of the device.
Innovation Solution
A power semiconductor device design that includes a joining layer with a first layer adjacent to the resin, containing voids filled with resin, where the filler in the resin has a maximum width greater than the minimum diameter of the voids in the first joining layer, enhancing the anchor effect and adhesion strength between the resin and the joining layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If sintered metal particles are used in the joining material, then joining temperature can be reduced below the melting point of bulk metal, but adhesion strength between the sintered metal compact and resin becomes insufficient
Solution Approach 1:
The invention utilizes the porous structure of the sintered metal compact by intentionally maintaining voids within the joining layer. These voids are strategically positioned to allow resin penetration, creating an interlocking structure that enhances adhesion. The porous nature of the sintered metal particles is leveraged rather than eliminated, transforming the potential weakness into a bonding mechanism.
Solution Approach 2:
The resin acts as an intermediary material that fills the voids in the sintered metal compact. By introducing this third material (resin) into the interface between the joining layer and the surrounding structure, the invention creates a transition zone that improves bonding. The resin penetrates and anchors into the porous structure, mediating the connection between the metal compact and external components.
2Stability of the object's composition
If the organic protective film on sintered metal particles is decomposed and removed, then contact between metal particles is promoted and sintering progresses, but the resin may detach from the joining layer
Solution Approach 1:
The invention maintains a controlled porous structure within the sintered metal compact after sintering. Rather than creating a fully dense structure, the process preserves voids that serve as anchoring points for the resin. This porous configuration is achieved by controlling sintering parameters to maintain approximately 30-70% theoretical density, ensuring both structural integrity and bonding capability.
Solution Approach 2:
The invention prepares the joining layer in advance by controlling the sintering process to create an optimal void structure before resin application. The void distribution and size are predetermined during manufacturing, creating pre-formed anchoring sites that will subsequently receive the resin. This preliminary structuring ensures that when resin is applied, it can immediately penetrate and bond to the prepared structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the adhesion strength between the resin and the joining layer, preventing resin detachment and enhancing the reliability and heat resistance of the power semiconductor device while maintaining cost-effectiveness.
Implementation Method 1
The resin is firmly anchored to the first joining layer. This improves the adhesion strength between the joining layer and the resin.
Data Source
AI summary
Provided is a technique of improving joint strength between a joining layer and a resin. A power semiconductor device includes a wiring member, a semiconductor element, a joining layer joining the wiring member and the semiconductor element to each other, and a resin covering the wiring member, the semiconductor element, and the joining layer. The joining layer includes a first joining layer provided to be adjacent to the resin and having a void filled with the resin. A filler contained in the resin has a maximum width greater than a minimum diameter of the void in the first joining layer.