Power Semiconductor Device Sealing via Tapered Feedthrough
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Solution Overview
Problem
Conventional power semiconductor devices face issues with reliable sealing of load connection elements against the housing, leading to potential water ingress due to gaps in the sealing material, especially at the edges of rectangularly contoured elements.
Innovation Solution
The design features a power semiconductor device with a housing having a first and second recess, forming an opening through which a load connection element with a tapered lead-through section is routed, and utilizing a continuous sealing element between the housing parts to ensure a secure seal, with a geometric shape that allows the sealing elements to nestle effectively, preventing gaps and ensuring reliable sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If load connection elements with rectangular contour are used and sealed with silicone sealing compound, then the sealing process is simple, but there are small areas on the edges where sealing material is absent, leading to inadequate sealing
Solution Approach 1:
The lead-through section is designed with a rounded contour instead of a rectangular shape. This curvature allows the sealing element to make continuous contact along the entire perimeter, eliminating the edge areas where sealing material would otherwise be absent. The rounded geometry ensures that sealing material can uniformly distribute and adhere to the entire surface without gaps.
Solution Approach 2:
The invention changes the geometric parameters of the load connection element by transitioning from a rectangular cross-section to a rounded cross-section. This parameter change in shape allows the sealing element to wrap around continuously, ensuring complete coverage and eliminating the sealing gaps that occur with rectangular contours.
2Stability of the object's composition
If load connection elements are passed through a recess in the housing, then the structural integration is improved, but the edges of the element create areas without sealing material over time
Solution Approach 1:
The rounded contour of the lead-through section eliminates sharp edges that would create stress concentration points and areas where sealing material cannot adhere properly. The curved geometry allows the sealing element to maintain continuous contact along the entire interface, preventing the formation of sealing gaps over time while maintaining structural integration through the housing recess.
3Device complexity
If conventional sealing elements are used with rectangular load connection elements, then the assembly is simple, but water ingress can occur through gaps at the edges
Solution Approach 1:
The rounded lead-through section design allows the sealing element to form a continuous barrier without gaps at the edges. This geometric modification ensures that water cannot penetrate through the housing by eliminating the edge areas that would otherwise serve as ingress paths, while maintaining a relatively simple assembly process.
Data Source
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AI summary
The invention relates to a power semiconductor device with a substrate (19) and with power semiconductor components (22) arranged on and connected to the substrate (19), wherein the power semiconductor device (1) has a housing (32) comprising a first housing part (13) having a first recess (15) and a second housing part (14), wherein the second housing part (14) is arranged relative to the first housing part (13) such that an opening (17) is formed in the housing (32) through the first recess (15), wherein the power semiconductor device (1) has an electrically conductive load connection element (2) for electrical contacting the power semiconductor device (1), which has an external connection section (2c) arranged outside the housing (32) and an internal connection section (2a) arranged inside the housing (32) and a feedthrough section (2b) passing through the opening (17).wherein the feedthrough section (2b) has a first outer edge region (7) tapering laterally towards a first outer edge (4) of the feedthrough section (2b) and a second outer edge region (8) tapering laterally towards a second outer edge (5) of the feedthrough section (2b), wherein the first and second outer edge regions (7, 8) are arranged facing away from each other and the first outer edge (4) is located in the region (26) of the lateral first end (A) of the opening (17) and the second outer edge (5) is located in the region (27) of the lateral second end (B) of the opening (17), wherein a first section (3a) of a first sealing element (3) is arranged between the first housing part (13) and the feedthrough section (2b) and a first section (6a) of a second sealing element (6) is arranged between the second housing part (14) and the feedthrough section (2b), wherein the first and second sealing elements (3,6) have contact with each other laterally from the first and second outer edges (4, 5). The invention provides a power semiconductor device in which at least one load connection element is reliably sealed against the housing of the power semiconductor device.