Power Semiconductor Module with Spring-Loaded Connection Element
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Solution Overview
Problem
Existing power semiconductor modules face challenges in easy arrangement and secure connection to electric motors, particularly due to rigid design limitations and insufficient durability under high ambient temperatures.
Innovation Solution
A power semiconductor module design featuring a recessed housing with a spring-loaded, rigid metallic connection element and an elastic retaining device, allowing for adjustable contact positioning and enhanced durability through a spring element that forms an electrically conducting pressure contact with the motor contact device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid metallic connection element is used, then electrical connectivity is ensured, but adaptability to positioning variations is reduced
Solution Approach 1:
The connection element is designed with elastic properties allowing it to deform and adapt to positioning variations while maintaining electrical contact. The elastic connection element can deflect to accommodate manufacturing tolerances and assembly variations, ensuring reliable electrical connectivity without requiring precise positioning.
Solution Approach 2:
The connection element's mechanical properties are optimized to balance rigidity for electrical conductivity and elasticity for positioning adaptability. By controlling the elastic modulus, geometry, and material properties, the connection element maintains sufficient stiffness for reliable electrical contact while having enough flexibility to adapt to position variations.
2Reliability
If a spring element is added for pressure contact, then connection reliability is improved, but device complexity increases
Solution Approach 1:
The spring element is integrated directly into the connection element itself, combining the functions of electrical connection and pressure application in a single component. This eliminates the need for separate pressure application mechanisms, reducing overall structural complexity while maintaining reliable pressure contact for electrical connectivity.
Solution Approach 2:
The connection element serves multiple functions simultaneously: it provides electrical conductivity, mechanical support, positioning adaptability, and pressure application through its elastic properties. This multi-functionality eliminates the need for separate dedicated components for each function, simplifying the overall device structure.
3Ease of operation
If the connection element is made movable in the direction of passage, then ease of arrangement is improved, but manufacturing precision requirements increase
Solution Approach 1:
The connection element is designed with elastic compliance that allows it to move and deform during assembly to accommodate positioning variations. This dynamic behavior enables easy arrangement and assembly while the elastic properties compensate for manufacturing tolerances, reducing the stringency of positioning precision requirements.
Solution Approach 2:
The elastic retaining device and spring element provide built-in compliance that cushions against positioning errors and manufacturing variations during assembly. This beforehand cushioning through elastic deformation allows for easier arrangement while tolerating less precise manufacturing, as the elastic elements absorb position deviations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and secure mounting of the power semiconductor module on electric motors, ensuring reliable electrical connectivity and thermal management while withstanding high temperatures and environmental influences.
Implementation Method 1
having a spring element, wherein the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that said connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage
Implementation Method 2
an internal contact device which has an electrically conducting contact inside the housing to an external connection element
Implementation Method 3
an electrically conducting pressure contact generated by the spring element of the power semiconductor module is formed between the outer contact surface and the associated motor contact device
Data Source
AI summary
A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.