Power Semiconductor Module Conductive Spring Contact
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Solution Overview
Problem
Conventional power semiconductor modules with spring-shaped control terminals face increased costs and man-hours in processing and attachment, limited contact pressure due to resin case height, require costly terminal reception parts, restrict dimensional design flexibility, and suffer from reliability issues due to direct soldering of springs to wiring patterns, leading to potential fractures over long-term use.
Innovation Solution
A power semiconductor module design featuring a conductive spring inserted into the control terminal, allowing it to make contact with the printed substrate, eliminating the need for soldering and reducing mechanical stress on internal components, while maintaining compatibility with existing module structures and allowing arbitrary distance settings between the substrate and module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the control terminal is formed in a spring structure and pressurized connected to a printed substrate, then soldering work is eliminated and reliability is improved, but cost and number of man-hours increase in processing and attachment
Solution Approach 1:
The invention divides the spring structure into two separate components: the control terminal and the conductive spring. The control terminal maintains its original rigid structure bonded to the wiring pattern, while a separate conductive spring is inserted into the control terminal to provide pressurization contact with the printed substrate. This segmentation eliminates the need to form complex spring structures during terminal processing, reducing manufacturing complexity and cost while maintaining reliability benefits.
Solution Approach 2:
The conductive spring acts as an intermediary component between the control terminal and the printed substrate. It transfers the pressurization force to ensure reliable electrical contact without requiring the control terminal itself to be spring-formed. This intermediary approach allows the use of simple rigid terminals bonded by conventional methods while still achieving the reliability benefits of pressurized contact.
2Reliability
If the spring length is increased to improve contact pressure, then reliability of contact is improved, but the spring length is limited by the height of the resin case
Solution Approach 1:
By separating the control terminal from the spring function, the invention allows the conductive spring to extend beyond the resin case height to reach the printed substrate. The control terminal remains within the case while the conductive spring protrudes outward, enabling adequate spring length for reliable contact pressure without being constrained by case dimensions.
3Reliability
If a terminal reception part with inside diameter matching the control terminal is used to hold the spring, then the spring is securely held, but cost and number of man-hours increase in manufacture
Solution Approach 1:
The control terminal structure serves multiple functions: it provides the electrical connection point, acts as a guide for the conductive spring insertion, and provides structural support. The existing control terminal geometry is utilized to hold the conductive spring without requiring additional specialized reception parts, reducing manufacturing complexity and cost.
4Volume of moving object
If the distance between printed substrate and module is reduced, then compactness is improved, but flexibility in dimensional design for users is reduced
Solution Approach 1:
The conductive spring provides a flexible, elastic connection that can accommodate varying distances between the module and the printed substrate. Users can select appropriate spring lengths to match different installation requirements, enabling both compact designs and larger spacing applications. This dynamic adjustment capability maintains adaptability while allowing optimized compactness when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the need for soldering, enhances reliability by distributing repulsion force evenly, and improves long-term performance without increasing costs or man-hours, while offering greater flexibility in dimensional design and reducing the risk of solder fractures.
Implementation Method 1
a conductive spring which is inserted into the control terminal so that an inner surface of the spring makes contact with at least a part of the side surface of the control terminal and is electrically connected to a printed substrate placed as opposed to the upper surface of the case by making pressurization contact with the printed substrate
Data Source
AI summary
A power semiconductor module comprising: a power semiconductor element; a case for receiving the power semiconductor element; a control terminal which is connected to a control electrode of the power semiconductor element, the control terminal is installed in a state of protruding from an upper surface of the case; and a conductive spring which is inserted into the control terminal so that an inner surface of the spring makes contact with at least a part of the side surface of the control terminal, the conductive spring is electrically connected to a printed substrate placed as opposed to the upper surface of the case by making pressurization contact with the printed substrate.