Power Semiconductor Temperature Detection with Loss-Based Correction
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Solution Overview
Problem
Existing temperature detection systems for power semiconductor devices do not accurately reflect the temperature due to a temperature difference between the sensor position and the highest temperature point, leading to inadequate overheat protection and loss in feedback control.
Innovation Solution
A temperature detection system that includes a chip temperature detection device, a loss-related characteristic value acquisition mechanism, a difference value calculation component, and a corrected temperature signal generation module, which calculates and corrects the temperature signal based on thermal resistance and load characteristics to provide a precise temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature sensor is placed at the highest temperature point of the power semiconductor device, then the temperature measurement precision is improved, but it adversely affects the performance of the power semiconductor device and makes wire bonding in the assembly process difficult
Solution Approach 1:
The patent introduces a temperature difference calculation mechanism that acts as an intermediary between the easily accessible sensor position and the highest temperature point. The correction value calculation unit computes the temperature difference based on thermal resistance and load characteristics, effectively bridging the gap without requiring direct contact at the highest temperature point.
Solution Approach 2:
The patent replaces the mechanical approach of physically placing the sensor at the highest temperature point with a computational approach. Instead of mechanical repositioning, the system uses calculation based on thermal resistance values and load characteristics to determine the temperature at the highest temperature point indirectly.
2Ease of manufacture
If the temperature sensor is placed away from the highest temperature point, then the ease of manufacture and wire bonding are improved, but the temperature measurement precision deteriorates due to temperature difference
Solution Approach 1:
The patent implements a feedback mechanism where the temperature difference calculation unit continuously computes the difference between the sensor position temperature and the highest temperature point temperature based on thermal resistance and load characteristics. This feedback loop allows the system to maintain accurate temperature measurement despite the sensor being positioned away from the highest temperature point.
Solution Approach 2:
The patent changes the measurement parameters by introducing thermal resistance values and load characteristics into the temperature calculation. Instead of directly measuring temperature at the highest temperature point, the system measures temperature at an accessible position and transforms this measurement into an accurate representation of the highest temperature point using parameter-based calculations.
3Device complexity
If the temperature detection system does not consider the varying temperature difference, then the device complexity is reduced, but the measurement precision deteriorates leading to inadequate overheat protection
Solution Approach 1:
The patent performs preliminary action by pre-establishing the relationship between thermal resistance, load characteristics, and temperature difference. The correction value calculation unit is configured to compute the temperature difference based on these predetermined parameters, allowing the system to maintain high measurement precision without adding significant operational complexity during runtime.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high precision in temperature measurement, enabling effective overheat protection and reduced loss in feedback control by accurately accounting for temperature differences and load characteristics.
Implementation Method 1
a difference value calculation means for calculating, from the loss-related characteristic value, a difference value between a temperature of the power semiconductor device and a temperature detected by the chip temperature detection device
Data Source
AI summary
A temperature detection system includes a power semiconductor device, a chip temperature detection device for detecting a temperature of the power semiconductor device, loss-related characteristic value acquiring means for acquiring a loss-related characteristic value that is a characteristic to decide a loss of the power semiconductor device, difference value calculating means for calculating, from the loss-related characteristic value, a difference value between the temperature of the power semiconductor device and a temperature detected by the chip temperature detection device, a corrected temperature signal generating part for generating a corrected temperature signal by adding the temperature detected by the chip temperature detection device and the difference value, and an output part for outputting the corrected temperature signal to the outside.