Power Semiconductor Terminal Contact via Elastic Pressure
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Solution Overview
Problem
Existing power semiconductor devices face challenges in reliably connecting load current terminal elements to substrates, particularly in compact and stacked configurations, where secure and efficient electrical contact is essential for optimal performance.
Innovation Solution
A power semiconductor device design featuring a substrate with power semiconductor components, electrically conductive load current terminal elements, a cooling device, and pressure devices with movable pressure elements and elastic deformation elements, which press the terminal elements against conductive contact areas on the substrate, ensuring reliable electrical contact through a combination of mechanical and elastic means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If load current terminal elements are connected to substrate using pressure devices, then electrical contact reliability is improved, but device complexity increases due to additional pressure elements and elastic deformation elements
Solution Approach 1:
The pressure device is segmented into distinct functional elements: a pressure element for applying force, an elastic deformation element for maintaining contact pressure, and a loading element for electrical connection. This segmentation allows each component to be optimized independently while working together to ensure reliable electrical contact.
Solution Approach 2:
The elastic deformation element acts as an intermediary between the pressure element and the load current terminal element. It mediates the force transmission while accommodating dimensional variations and ensuring consistent contact pressure, thereby improving electrical contact reliability without requiring complex adjustment mechanisms.
2Adaptability or versatility
If pressure elements are made movable in normal direction to substrate, then contact adaptability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The pressure element is designed to be movable in the normal direction to the substrate, transforming a static connection into a dynamic one. This allows the pressure element to adapt to substrate position variations and maintain optimal contact pressure automatically, reducing the need for high manufacturing precision.
Solution Approach 2:
The system utilizes changes in the position parameter of the pressure element to adapt to manufacturing tolerances. By allowing the pressure element to move and adjust its position, the system compensates for variations in substrate positioning and terminal element dimensions, maintaining reliable electrical contact despite manufacturing imprecisions.
3Reliability
If elastic deformation element is used between pressure element and terminal element, then contact reliability is improved, but device complexity increases
Solution Approach 1:
The elastic deformation element provides beforehand cushioning by absorbing dimensional variations and position deviations before they affect the electrical contact. This pre-compression approach ensures that contact reliability is maintained even when manufacturing tolerances cause variations in component positions.
Solution Approach 2:
The elastic deformation element utilizes changes in its deformation parameter to compensate for dimensional variations in the system. As the pressure element moves or components experience thermal expansion, the elastic element adjusts its deformation state to maintain consistent contact pressure, improving reliability without requiring complex control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables reliable and efficient electrical contact between load current terminal elements and the substrate, allowing for the simple realization of stacked power semiconductor device systems with improved reliability and reduced torque on the terminal elements.
Implementation Method 1
an elastic deformation element, which is arranged between the pressure element and an assigned load current terminal element, wherein the pressure element presses the assigned load current terminal element against an electrically conductive contact area of the substrate via the elastic deformation element
Data Source
AI summary
The invention relates to a power semiconductor device with a substrate with a cooling device and power semiconductor components connected thereon, having load current terminal elements and a cooling device. Pressure devices have a pressure element is arranged movably in a direction normal (N) to the substrate, and an elastic deformation element between the pressure element and a load current terminal element. The pressure element presses the assigned load current terminal element against an electrically conductive contact area of the substrate via the elastic deformation element and provides electrically conductive pressure contacting of the assigned load current terminal element with the substrate. The electrical connection of the power semiconductor device is improved.