Dual-Sided Power Semiconductor Layout to Suppress Turn-Off Filaments
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Solution Overview
Problem
Existing power semiconductor devices face challenges in efficiently managing charge carrier distribution and reducing the risk of current filaments during switching operations, particularly at the back side of the semiconductor body, which can lead to device destruction.
Innovation Solution
The power semiconductor device incorporates control electrodes at both the front and back sides of the semiconductor body, with planar electrodes at the back side and trenches at the front side, and employs modified control areas to reduce the effectiveness of back-side electrodes in specific regions, enhancing charge carrier removal and reducing filament risk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If second control electrodes are provided at the second side for controlling load current in second semiconductor channel structures, then switching behavior and charge carrier distribution are optimized, but current filaments may form and device destruction may occur during turn-off operations
Solution Approach 1:
The patent applies local quality by creating a modified control area (AMC) at the second side of the semiconductor body where the properties of control electrodes are locally altered. In this AMC, either no second control electrodes are provided or they are less effective in removing free charge carriers compared to areas outside the AMC. This localized modification prevents current filaments from forming in critical regions while maintaining effective control in other areas, thus resolving the contradiction between reliable switching behavior and prevention of harmful current filaments.
2Productivity
If second control electrodes are effective in removing free charge carriers during turn-off, then switching performance is improved, but device robustness decreases due to current filament formation
Solution Approach 1:
The patent implements local quality by spatially differentiating the effectiveness of second control electrodes across the semiconductor body. The modified control area (AMC) is defined where second control electrodes are either absent or less effective, while outside this area they maintain full effectiveness. This allows the device to achieve high switching performance in non-AMC regions while ensuring device robustness in AMC regions where current filament formation would be harmful, thus resolving the contradiction between switching performance and device robustness.
3Ease of manufacture
If control electrodes are implemented as planar electrodes, then manufacturing complexity is reduced and production is simplified, but control precision over charge carrier removal may be compromised
Solution Approach 1:
The patent resolves this contradiction by applying local quality through the modified control area (AMC) concept. In the AMC, the reduced or absent second control electrodes compensate for the less precise control inherent in planar electrode geometry. Outside the AMC, full control precision is maintained with conventional control electrode structures. This allows the use of simpler planar electrodes in critical areas where precision is less critical, while maintaining manufacturing simplicity overall without sacrificing necessary control precision in active regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the robustness of the device during turn-off operations by inhibiting further space charge regions and minimizing filament formation, facilitating efficient charge carrier removal and simplifying the production process.
Implementation Method 1
first control electrodes for controlling the load current in first semiconductor channel structures formed in the active region at the first side, and at the second side and electrically isolated from the first load terminal and the second load terminal, second control electrodes for controlling the load current in second semiconductor channel structures formed in the active region at the second side
Data Source
AI summary
A power semiconductor device includes at a first side and electrically isolated from first and second load terminals, first control electrodes for controlling a load current in first semiconductor channel structures formed in an active region at the first side, and at a second side and electrically isolated from the first and second load terminals, second control electrodes for controlling the load current in second semiconductor channel structures formed in the active region at the second side. At the second side and in a contiguous area of modified control (AMC) belonging to the active region and having a lateral extension of at least 30% of a thickness of a semiconductor body of the device, either no second control electrodes are provided or the second control electrodes are less effective in removing free charge carriers out of the power semiconductor device than the second control electrodes outside the AMC.


