Power Source Unit Cooling Structure for Electronic Devices
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Solution Overview
Problem
Conventional cooling structures for electronic devices, such as servers, face inefficiencies in cooling power source units due to complex air passage designs and adjacent power source arrangements, leading to increased weight, cost, and reduced cooling effectiveness.
Innovation Solution
A simple cooling structure where power source units are positioned downstream of electronic parts and spaced apart in the width direction to prevent overlapping airflow, allowing cooling air to effectively cool power source units without being warmed by CPUs, reducing the need for high-speed or numerous fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power source units are disposed adjacently in the downstream direction of cooling air flow, then space utilization is improved, but cooling effectiveness deteriorates due to heat accumulation
Solution Approach 1:
The patent transitions from a linear arrangement of power source units along the cooling air flow direction to a distributed arrangement in the width direction (perpendicular to the flow). This dimensional change allows power source units to be spaced apart, preventing heat accumulation while maintaining efficient use of available space within the housing.
2Temperature
If cooling air flow speed is increased to cool power source units effectively, then cooling effectiveness is improved, but power consumption and noise increase
Solution Approach 1:
The patent performs preliminary cooling of the cooling air flow by passing it through or near the CPUs (which are positioned upstream) before the air reaches the power source units. This pre-cooling action reduces the temperature differential requirement for cooling the power source units, allowing lower fan speeds and reduced power consumption while maintaining effective cooling.
3Temperature
If complex air passages are formed for separate cooling of logic units and power source units, then cooling effectiveness is improved, but device complexity and weight increase
Solution Approach 1:
The patent employs a universal cooling air flow path that serves multiple functions: the same cooling air flow that cools the CPUs also subsequently cools the power source units. This eliminates the need for separate dedicated air passages for different components, simplifying the overall cooling structure while maintaining effective cooling for all heat-generating elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency for power source units, reduces power consumption and noise, lowers the failure rate, and allows for the use of high-density power units, thereby decreasing the server's size and cost while maintaining reliability.
Implementation Method 1
a plurality of fans (3) which are arranged inside the housing (2) so as to cause cooling air to propagate in the longitudinal direction
Data Source
AI summary
A cooling structure is designed for an electronic device including a plurality of fans causing cooling air, a plurality of electronic parts serving as heat sources, and a plurality of power source units, all of which are arranged inside the housing. The electronic parts are positioned in the downstream side of cooling air produced by the fans, while the power source units are positioned in the further downstream side of cooling air compared to the electronic parts. The power source units are spaced out from each other in the perpendicular direction to the cooling airflow direction of cooling air such that the power source units do not overlap with the electronic parts in the cooling airflow direction in plan view. The cooling structure prevents cooling air, which is temporarily warmed by the electronic parts, from directly flowing into the power source units, thus improving a cooling effect.