Power Stage Circuit with Modular Package Unit for Mining Boards
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Cryptocurrency mining machines face challenges with high electrical power consumption and the unavailability of compatible DC-DC power sources, leading to the use of alternative power supply integrated circuit chips that require frequent revisions and increase costs due to incompatibility issues.
Innovation Solution
A power stage circuit and power supply package unit for calculation boards, featuring an input circuit, output circuit, and package pins, with semiconductor field effect transistors and a voltage stabilizing circuit, allowing for compatibility with various DC-DC power supplies, reduced design complexity, and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If alternative power supply integrated circuit chips are used to replace unavailable DC-DC power sources, then power supply availability is improved, but peripheral circuit compatibility deteriorates requiring frequent revisions
Solution Approach 1:
The patent introduces a power supply package unit as an intermediary component that contains the power supply integrated circuit chip and its compatible peripheral circuits in a pre-integrated package. This mediator absorbs the compatibility issues between different power supply chips and the calculation board, allowing the board to work with various power supply chips without revision. The package unit serves as the interface between the board and power supply technology, resolving the adaptability problem while maintaining reliability.
Solution Approach 2:
The patent segments the power supply system into two independent parts: the calculation board and the replaceable power supply package unit. By separating the power supply integrated circuit chip and its peripheral circuits into a distinct modular package, the board design remains stable while the package can be easily replaced or upgraded. This segmentation eliminates the need to revise the entire board when changing power supply chips.
2Adaptability or versatility
If peripheral circuits are revised for each replaced power supply integrated circuit chip, then power supply compatibility is improved, but device complexity and maintenance difficulty increase
Solution Approach 1:
The power supply package unit is designed with universal compatibility features that allow a single package design to work with multiple different power supply integrated circuit chips. The package incorporates standardized peripheral circuits and interface designs that can accommodate various chip types, making the system universally adaptable without requiring custom revisions for each chip model.
Solution Approach 2:
The patent creates a standardized template or copy of the power supply package unit design that can be replicated with different power supply chips. Instead of designing unique peripheral circuits for each chip, the same proven package design is copied and adapted, reducing complexity and ensuring consistency across different versions.
3Reliability
If power supply integrated circuit chips are replaced frequently, then power supply availability is maintained, but manufacturing cost and maintenance cost increase
Solution Approach 1:
The patent performs preliminary integration of the power supply integrated circuit chip with its required peripheral circuits during the package manufacturing process. By pre-assembling and testing the complete power supply unit before deployment, compatibility issues are resolved in advance, and the finalized package can be mass-produced with standardized procedures, reducing manufacturing costs compared to custom board revisions.
Solution Approach 2:
The patent merges the power supply integrated circuit chip and its peripheral circuits into a single integrated package unit. This combination reduces the total component count and assembly steps required, simplifying manufacturing processes and reducing costs. The merged package can be produced more efficiently than separate components requiring individual mounting and configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible and stable power supply compatibility, reduces design difficulties, and lowers maintenance costs by allowing easy replacement of power supply integrated circuit chips without redesigning the calculation board, while maintaining power supply stability.
Implementation Method 1
The input circuit comprises at least two semiconductor field effect transistors connected in series, and the semiconductor field effect transistors are electrically connected to the package pins
Implementation Method 2
the output circuit is a voltage stabilizing circuit for supplying a current and a stable voltage to one or more integrated circuit chips to be powered on a calculation board
Data Source
AI summary
A power stage circuit and a calculation board. The power stage circuit includes an input circuit and an output circuit. The input circuit and the output circuit are electrically connected. The power stage circuit also includes a plurality of package pins. The plurality of package pins are respectively connected to the input circuit, the output circuit, and a power supply package unit.