Power Storage Stack Fixing via Thermally Conductive Adhesive
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power storage devices face issues with fixing the power storage stack to the accommodation case, leading to potential deformation and short circuits due to dew condensation, especially when the cooler is disposed outside the case.
Innovation Solution
A power storage device configuration that includes a thermally conductive adhesive layer with a protruding portion to securely fix the power storage stack to the bottom wall of the accommodation case, featuring a receiving surface and a lower wall portion to prevent deformation and direct dew condensation water away from the stack, while also incorporating a cooler outside the case for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the power storage stack is fixed to the bottom wall portion with a thermally conductive adhesive layer without additional measures, then the fixing structure is simple, but the pressing load is insufficient and the bottom wall portion deforms
Solution Approach 1:
The bottom wall portion is designed with a three-dimensional structure including a receiving portion and a lower wall portion positioned at a lower level. This dimensional change creates structural rigidity without adding complex fixing mechanisms, allowing the adhesive layer to effectively press the power storage stack while preventing bottom wall deformation.
2Device complexity
If the power storage stack is fixed directly to the bottom wall portion, then the fixing configuration is simple, but dew condensation water causes short circuit
Solution Approach 1:
The lower wall portion is positioned at a level lower than the receiving surface where the power storage stack is mounted. This dimensional arrangement creates a drainage path for dew condensation water to flow away from the stack, preventing short circuits while maintaining a simple fixing configuration.
Solution Approach 2:
The design utilizes the natural flow of dew condensation water toward the lower wall portion, converting the potential harmful effect of condensation into a beneficial drainage mechanism that protects the power storage stack from short circuits.
3Volume of stationary object
If the cooler is disposed outside the accommodation case, then space in the case is effectively utilized, but the power storage stack requires additional fixing measures
Solution Approach 1:
The bottom wall portion's three-dimensional structure with the lower wall portion at a reduced level provides both the necessary fixing strength and structural support, eliminating the need for additional fixing measures even when the cooler is positioned outside the accommodation case.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a simple and effective fixation of the power storage stack, reducing pressing load loss and preventing short circuits during dew condensation, while maintaining efficient heat transfer and cooling of the stack.
Implementation Method 1
an adhesive layer that has thermal conductivity and fixes the power storage stack to the bottom wall portion
Implementation Method 2
when dew condensation occurs in the accommodation case, dew condensation water moves to the lower wall portion located at a position lower in level than the receiving surface
Data Source
AI summary
A power storage device comprises: a power storage stack; an accommodation case that has a bottom wall portion and accommodates the power storage stack therein; and an adhesive layer that has thermal conductivity and fixes the power storage stack to the bottom wall portion. The bottom wall portion includes a receiving portion that has a receiving surface on which the power storage stack is received, a lower wall portion located at a position lower in level than the receiving surface, and a connecting portion that interconnects the receiving portion and the lower wall portion. The adhesive layer includes a portion disposed between the receiving surface and the power storage stack, and a protruding portion that protrudes from the receiving surface to the connecting portion.