Power Supply Airflow Driving Device Layout Flexibility
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Solution Overview
Problem
Conventional power supply apparatuses in redundant systems have limited layout flexibility and suffer from reduced fan life and performance due to predetermined airflow direction, leading to elevated temperatures and noise.
Innovation Solution
The power supply apparatus features an airflow driving device positioned in the middle region of the casing with dual airflow openings, allowing for efficient heat removal and flexible AC socket placement on either side, enhancing layout flexibility and reducing fan noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the fan is mounted on one side of the casing with predetermined airflow direction, then the structure is simple and easy to manufacture, but the layout flexibility is insufficient and the fan operates in high temperature environment leading to shortened life and impaired performance
Solution Approach 1:
The patent makes the airflow direction dynamic by allowing the fan to be mounted on different sides of the casing (front or rear) depending on the installation requirement. This dynamic configuration enables the system to adapt to different layout requirements while maintaining optimal cooling performance, resolving the contradiction between layout flexibility and fan reliability.
Solution Approach 2:
The patent changes the mounting position parameter of the fan from fixed to variable. By providing airflow openings at both front and rear sides of the casing and allowing the fan to be installed on either side, the system can adjust the airflow direction parameter to match different installation environments, thereby improving both layout flexibility and fan operating conditions.
2Ease of manufacture
If the fan is mounted on one side of the casing, then the manufacturing process is simple, but the airflow temperature in the vicinity of the fan is elevated causing noise and reduced efficiency
Solution Approach 1:
The patent employs asymmetric design by providing different configurations for front and rear airflow openings. The front airflow opening has a first configuration while the rear airflow opening has a second configuration, allowing optimization of airflow patterns to reduce temperature in the fan vicinity while maintaining manufacturing simplicity through standardized components.
3Adaptability or versatility
If the AC socket is positioned at fixed location, then the structure is stable and easy to manufacture, but the layout flexibility is reduced
Solution Approach 1:
The patent makes the AC socket positioning universal by providing mounting capability at both front and rear sides of the casing. This multi-position mounting design allows the AC socket to be installed at the most convenient location for each specific application without increasing structural complexity, as the same modular components are used in different configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration extends the life and performance of the power supply apparatus by reducing airflow temperature and enabling stable electricity supply while allowing for flexible AC socket placement, thus improving overall system reliability and usability.
Implementation Method 1
A cooling air is pumped by the airflow driving device to be introduced into the inner portion of the casing through one of the first airflow opening and the second airflow opening, then the heat generated from the electronic components is removed by the cooling air
Data Source
AI summary
A power supply apparatus for use with a redundant power supply system includes a casing, a main circuit board and an airflow driving device. The casing includes a first airflow opening and a second airflow opening. The main circuit board is disposed within the casing and includes plural electronic components thereon. The airflow driving device is disposed in the middle region of the main circuit board. A cooling air is pumped by the airflow driving device to be introduced into the inner portion of the casing through one of the first airflow opening and the second airflow opening, then the heat generated from the electronic components is removed by the cooling air, and finally a heated air is exhausted through the other one of the first airflow opening and the second airflow opening.