Power Supply Busbar Layout for Shorter High-Current Paths
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Solution Overview
Problem
Conventional power supplies have longer transmission paths, higher path impedance, and reduced current-carrying capacity due to numerous solder joints and surface-embedded gold finger boards, leading to increased temperature and loss, especially in high-current scenarios.
Innovation Solution
A power supply design with a transformer and rectifier assembly on a main board, utilizing metal output busbars with sub-busbars that directly connect to rectifier boards, reducing transmission paths and solder joints, and using metal busbars for current conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional power supply uses rectifier board soldered on main board with gold finger board for current output, then the power supply can transmit power to external system, but the transmission path becomes longer and path impedance increases
Solution Approach 1:
The patent integrates the rectifier board and gold finger board into a single integrated circuit board, eliminating the need for separate soldering connections and busbars. This merging of previously separate components directly shortens the transmission path from the transformer to the external system output interface.
Solution Approach 2:
The patent removes the intermediate busbar component from the power transmission path. By directly connecting the rectifier output to the gold finger board contacts, the busbar is extracted from the system, thereby reducing the number of connection interfaces and shortening the overall transmission path.
2Ease of operation
If conventional power supply uses multiple solder joints between rectifier board, busbar, and gold finger board, then the components can be connected, but the path impedance increases and power loss increases
Solution Approach 1:
The patent combines the rectifier board and gold finger board into one integrated board, eliminating multiple solder joint interfaces. This single-board integration removes the cumulative impedance of multiple solder connections, thereby reducing power loss while maintaining component connectivity.
Solution Approach 2:
The patent extracts and removes the busbar component that introduced additional solder joints and connection interfaces. By eliminating this intermediate component, the number of solder joints is reduced, path impedance is lowered, and power loss is minimized.
3Ease of manufacture
If conventional power supply uses gold finger board with surface-embedded copper, then the board can be manufactured, but the current-carrying capacity is weakened especially in high-current scenarios
Solution Approach 1:
The patent employs composite construction with thick copper layers combined with copper foil on the integrated circuit board. This composite material approach provides both the manufacturability of standard PCB technology and the high current-carrying capacity required for high-power applications, overcoming the limitation of surface-embedded copper alone.
4Ease of operation
If conventional power supply uses long transmission path with multiple interfaces, then the power can be transmitted to external system, but the temperature increases and efficiency decreases
Solution Approach 1:
The patent merges the rectifier and output interface into a single integrated board, shortening the power transmission path. This reduction in path length decreases the resistance and associated I²R losses, thereby reducing heat generation and operating temperature while maintaining the power transmission function.
Solution Approach 2:
The patent removes the busbar and its associated solder joints from the power transmission path. This extraction eliminates additional thermal resistance and connection losses, leading to lower operating temperatures and improved efficiency while preserving the essential power transmission capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces transmission paths, lowers path impedance, enhances current-carrying capacity, and decreases temperature and power loss, particularly in high-current scenarios.
Implementation Method 1
The rectifier assembly is configured to rectify the output of the transformer
Implementation Method 2
The first output busbar includes a first sub busbar and a second sub busbar. The first sub busbar and the rectifier assembly are connected with each other. The second sub busbar is parallel to the main board and extended in a direction away from the transformer
Data Source
AI summary
A power supply is provided. The transformer is disposed on the upper surface of the main board and electrically connected with the main board. The rectifier assembly is disposed on one side of the upper surface of the main board and electrically connected with the transformer. The output of the transformer is rectified by the rectifier assembly. The first output busbar and the second output busbar are disposed on the upper surface of the main board. The first sub busbar of the first output busbar and the third sub busbar of the second output busbar are connected with the rectifier assembly. The second sub busbar of the first output busbar and the fourth sub busbar of the second output busbar are parallel to the main board and extended away from the transformer.