3D Stacked Power Supply Circuit Carriers for High Density
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Solution Overview
Problem
Existing power supply circuits face limitations in miniaturization, with high volume and low power density, and inflexibility in safety distance configurations between primary and secondary sides, hindering their integration into devices and user-friendly design.
Innovation Solution
A power supply circuit design where the primary and secondary sides are mounted on separate circuit carriers, mechanically and electrically coupled in multiple planes, allowing for a three-dimensional arrangement that increases power density and flexibility in safety distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a two-dimensional printed circuit board is used for power supply circuits, then the circuit layout is simple and manufacturing is easy, but the volume is large and power density is low
Solution Approach 1:
The patent transitions from a two-dimensional printed circuit board layout to a three-dimensional stacked arrangement of circuit carriers. Multiple circuit carriers are arranged vertically in stacks, allowing primary and secondary circuits to be positioned in different planes and layers. This dimensional change enables significantly reduced volume while maintaining manufacturing feasibility through standardized carrier modules.
Solution Approach 2:
The power supply circuit is divided into separate circuit carriers that can be independently manufactured and then assembled into stacks. Each carrier contains specific functional components (primary circuit, secondary circuit, or auxiliary circuits), allowing parallel manufacturing and optimized layout planning for each segment before final assembly.
2Reliability
If conventional discrete components are used, then component selection is flexible and reliability is high, but minimum dimensions are large and miniaturization is limited
Solution Approach 1:
Multiple discrete components are integrated onto single circuit carriers, combining multiple functions into unified modules. This merging reduces the overall number of separate components and their associated mounting space, while maintaining the reliability benefits of discrete component technology through proven carrier designs and standardized integration methods.
3Reliability
If air and leakage paths are observed for electrical isolation between primary and secondary circuits, then safety is ensured, but the distance between components must be large and configuration flexibility is reduced
Solution Approach 1:
The patent uses vertical stacking to separate primary and secondary circuits into different planes and layers. Electrical isolation is achieved through multiple insulation layers and controlled air gaps in the vertical direction, rather than relying solely on horizontal spacing. This allows much closer component placement while maintaining required safety distances through the third dimension.
Solution Approach 2:
Insulation layers and structural elements are introduced as intermediaries between primary and secondary circuit carriers. These intermediary layers provide the required electrical isolation and safety clearance while enabling flexible component positioning on each carrier face, decoupling the safety requirement from component layout constraints.
4Ease of operation
If the power supply circuit is miniaturized and integrated into the output connector, then device integration is improved and user-friendliness increases, but the volume reduction must be achieved without compromising safety distances
Solution Approach 1:
The stacked carrier arrangement allows the power supply circuit to be compressed in the horizontal plane while maintaining vertical separation between primary and secondary circuits. This enables integration into compact output connectors and devices while preserving required safety distances through the vertical stacking architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves significant miniaturization and increased power density, enabling more compact and flexible configurations while maintaining electrical safety, allowing for integration into devices and improved user-friendliness.
Implementation Method 1
at least one transformer which is connected to a primary side circuit and to a secondary side circuit
Data Source
AI summary
The present invention relates to a power supply circuit comprising at least one transformer which is connected to a primary side circuit and to a secondary side circuit. The present invention further relates to a method for producing such a power supply circuit. To provide an improved power supply circuit which has a reduced size and increased power density and offers more flexibility in the formation of the safety distances between primary side and secondary side, the primary side circuit and the secondary side circuit are each mounted on at least one separate circuit carrier, said circuit carriers being mechanically and electrically coupled to one another and arranged in at least two different planes. According to advantageous embodiments, said circuit carriers may be arranged in planes that are either parallel with or transverse to one another.