Power Supply Circuit Damping for Package Oscillation Control
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Solution Overview
Problem
Existing semiconductor package structures face issues with oscillation and interference in power supply circuits, leading to instability and reduced reliability of die circuits.
Innovation Solution
Incorporating a parallel resistor-inductor-capacitor (RLC) circuit configuration, including a first resistor connected in series with a series RLC circuit, to reduce the quality factor and oscillation of the power supply circuit, thereby stabilizing the power supply and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional power supply circuit is used without additional damping components, then the circuit structure is simple, but the circuit produces oscillation and interference leading to instability
Solution Approach 1:
A first circuit comprising a first resistor, first inductor, and first capacitor connected in series is introduced as an intermediary damping circuit between the power supply and the die circuit. This intermediate circuit absorbs oscillations and reduces interference without fundamentally changing the power supply architecture, thereby improving stability while maintaining reasonable structural simplicity.
Solution Approach 2:
The damping characteristics of the power supply circuit are optimized by adjusting the parameters (resistance, inductance, capacitance values) of the first circuit components. By changing these parameters, the circuit's quality factor and oscillation characteristics are controlled to achieve stable power supply while minimizing complexity.
2Stability of the object's composition
If damping components are added to reduce oscillation, then power supply stability is improved, but the circuit complexity increases
Solution Approach 1:
The damping function is merged with the existing power supply circuit by integrating the first circuit components (resistor, inductor, capacitor) into the power distribution network. This combination approach achieves oscillation damping without requiring separate, standalone damping circuits, thereby limiting the increase in overall system complexity.
3Object-affected harmful factors
If the quality factor of the power supply circuit is reduced to minimize oscillation, then interference to die circuit is reduced, but the circuit becomes more complex
Solution Approach 1:
The first circuit components are configured to convert harmful oscillations and interference into beneficial damping effects. The resistor dissipates oscillation energy as heat, the inductor and capacitor store and release energy to counteract oscillations, thereby transforming potentially harmful high-quality factor resonances into stable, low-interference power delivery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of the power supply by minimizing oscillations and interference, ensuring stable voltage transmission to die circuits, thus improving the overall performance and functionality of semiconductor devices.
Implementation Method 1
a first resistor connected in series with a series RLC circuit, to reduce the quality factor and oscillation of the power supply circuit
Implementation Method 2
the second circuit, the first circuit and the first resistor are equivalent to a parallel resistor-inductor-capacitor circuit
Implementation Method 3
the second circuit, the first circuit and the first resistor are equivalent to a parallel resistor-inductor-capacitor circuit
Data Source
AI summary
Implementations of the present disclosure disclose electronic devices, electronic systems and power supply circuits. An example electronic device includes: a power supply structure including a node, through which a voltage is supplied; and a first circuit having its one end coupled to the node via a first resistor and the other end grounded; and a package structure including a second circuit and a die circuit that are connected in parallel between the node and a grounding node, wherein the second circuit, the first circuit and the first resistor are equivalent to a parallel resistor-inductor-capacitor circuit.