Power Supply Coil Cooling via Airflow Layout
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Solution Overview
Problem
Existing power supply devices face challenges in effectively cooling coils due to inadequate airflow distribution, particularly when multiple coils are arranged closely together, leading to increased winding temperatures.
Innovation Solution
The power supply device employs an air blower configuration where coils are positioned such that they are directly within the airflow path, with one coil being placed closer to the blower than the other, ensuring that both coils are fully exposed to the airflow for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If two coils are successively arranged on a substrate, then the device can be compact and efficient, but the airflow from the fan may not directly reach all coils, causing insufficient cooling and increased winding temperature
Solution Approach 1:
The patent changes the spatial arrangement of coils from a linear successive arrangement to a two-dimensional layout where multiple coils are positioned side-by-side in the airflow direction. This dimensional change ensures that all coils are directly exposed to the fan's airflow, eliminating shadowed regions and improving cooling efficiency without increasing device volume.
Solution Approach 2:
The patent employs asymmetric positioning of coils relative to the fan, where coils are arranged at different positions along the airflow path but all within the effective cooling zone. This asymmetric layout optimizes airflow distribution across all coils, ensuring each coil receives sufficient direct airflow for effective heat dissipation.
2Area of stationary object
If coils are arranged in a high-density layout, then the device size is reduced, but the temperatures of parts and coil windings are likely to increase
Solution Approach 1:
The patent transitions from a one-dimensional linear coil arrangement to a two-dimensional grid-like arrangement, allowing coils to be packed more densely in the planar direction while maintaining optimal spacing for airflow. This enables higher coil density within the same device footprint while ensuring all coils remain accessible to the cooling airflow.
Solution Approach 2:
The patent optimizes the local positioning of each coil within the high-density layout, ensuring that every coil is placed within the effective airflow coverage zone. This local optimization ensures that even in a compact high-density configuration, each individual coil receives adequate direct airflow for effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement effectively reduces coil temperatures by ensuring that both coils are directly impacted by the airflow, providing enhanced heat dissipation and cooling efficiency.
Implementation Method 1
a configuration for cooling a coil using a fan is used in the power supply device
Data Source
AI summary
A power supply device that can effectively cool a plurality of coils using an air blower when such coils are arranged, for example, adjacent to each other is provided. The power supply device includes a first coil, a second coil, a substrate, an air blower, and a housing that houses the first coil, the second coil, the substrate, and the air blower. The first coil and the second coil are connected in series or in parallel. At least parts of the first coil and the second coil are included in a field of view at a viewpoint at which the first coil and the second coil are seen in the same direction as an air blowing direction of the air blower.