Power Supply Control Circuit Module Peripheral Electrode Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power supply control circuit modules for communication devices face inadequate heat dissipation, particularly for DC-DC converter switching IC elements and electrode patterns, due to positional relationships that hinder efficient heat dissipation of both the IC elements and the circuits through which large currents flow.
Innovation Solution
The power supply control circuit module incorporates first inner-layer electrodes positioned closer to the periphery of the multilayer body, with larger cross-sectional areas than second inner-layer electrodes, to enhance heat dissipation. These electrodes are connected to DC output terminals and arranged in different layers to prevent heat propagation and noise interference, while external connection terminals are placed near the periphery to improve heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electrode patterns are determined based on positional relationships between the IC element and other circuit elements, then the circuit layout is simplified, but the heat dissipation performance of the electrode patterns becomes inadequate
Solution Approach 1:
The patent segments the electrode functions into multiple types: first inner-layer electrodes for large current transmission and heat dissipation, second inner-layer electrodes for control signals, and surface-mounted IC elements. This segmentation allows each electrode type to be optimized independently for its specific function, with first inner-layer electrodes having larger cross-sectional areas specifically for heat dissipation while maintaining simplified routing through the multilayer structure.
2Temperature
If first inner-layer electrodes are positioned closer to the periphery of the multilayer body, then the heat dissipation efficiency is improved, but the conductor loss increases due to longer current paths
Solution Approach 1:
The patent changes the cross-sectional area parameter of the first inner-layer electrodes to compensate for the increased path length. By increasing the cross-sectional area, the electrical resistance is reduced, which offsets the increased conductor loss from the longer current path required to reach the periphery for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation efficiency for power supply control IC elements and circuit elements handling large currents, reducing conductor loss and parasitic inductance, and preventing noise interference, resulting in a highly efficient heat dissipation system.
Implementation Method 1
heat generated at the first inner-layer electrodes is easily be dissipated to outside
Implementation Method 2
first inner-layer electrodes that connect the power supply control IC element and the circuit elements
Implementation Method 3
cross-sectional areas of the first inner-layer electrodes are larger than cross-sectional areas of the second inner-layer electrodes
Data Source
AI summary
A power supply control IC is mounted on a surface of a multilayer body that defines a power supply control circuit module. A first inner-layer electrode connecting an inductor element and a switching regulator element for the power supply control IC, another first inner-layer electrode connecting the inductor element and a capacitor element, and still another first inner-layer electrode connecting the switching regulator element and the capacitor element are located on upper layer regions of the multilayer body and are routed in between a mounting area of the power supply control IC and a peripheral wall of the multilayer body. The first inner-layer electrodes have widths that are wider than those of second inner-layer electrodes which are located near a center region of the multilayer body and transmit control signals.