Power Supply Control Circuit Temperature Sensor Integration
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Solution Overview
Problem
In solid-state drives (SSDs) with non-volatile semiconductor memory, the existing temperature sensing and power supply control systems require separate wiring patterns, leading to increased complexity and size due to the need for independent connections between the controller, temperature sensor, and power supply circuit, which complicates miniaturization and increases manufacturing costs.
Innovation Solution
Integration of a temperature sensor element within the power supply circuit, utilizing a serial communication standard like I2C for data transmission, allowing the controller to receive temperature data and adjust power supply voltages, thereby eliminating the need for additional signal lines and reducing the component mounting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If separate wiring patterns are provided for temperature sensor and power supply circuit, then independent control is achieved, but device complexity and substrate area increase
Solution Approach 1:
The temperature sensor and power supply circuit are integrated into a single integrated circuit chip, merging previously separate components. This reduces wiring complexity on the substrate while maintaining independent control capabilities through internal circuit architecture.
Solution Approach 2:
The integrated circuit performs multiple functions including temperature sensing, power supply voltage generation, and serial communication, all within a single component. This multi-functionality eliminates the need for separate dedicated components and their associated wiring.
2Ease of operation
If separate wiring patterns are provided for temperature sensor and power supply circuit, then independent control is achieved, but mounting area increases
Solution Approach 1:
The temperature sensor and power supply circuit are merged into a single integrated circuit chip, significantly reducing the total mounting area required on the substrate compared to housing them as separate components with independent connections.
3Adaptability or versatility
If multiple independent components are used, then functional separation is achieved, but manufacturing cost increases
Solution Approach 1:
Integrating multiple functions into a single chip reduces the total component count, assembly steps, and testing requirements, thereby lowering manufacturing costs despite maintaining functional separation through internal circuit design.
Solution Approach 2:
The integrated circuit is designed with segmented functional blocks for temperature sensing, power supply, and communication that can be independently controlled and tested, maintaining functional separation benefits while achieving manufacturing efficiency through integration.
Data Source
AI summary
According to one embodiment, a memory system includes first, second, and third ICs. The first IC includes a non-volatile semiconductor memory. The second IC includes a controller configured to control the non-volatile semiconductor memory. The third IC is configured to receive an external first power supply voltage and generate a second power supply voltage. The third IC is connected to the second IC via an interface according to a serial communication standard. A temperature sensor element is connected to the third IC.