Power Supply Module Cooling via Vertical Inductor Stacking
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Solution Overview
Problem
Existing power supply modules face challenges in miniaturization while maintaining effective cooling for high-current power components, especially when placed near inductive components with low thermal conductivity.
Innovation Solution
The power supply module design includes a substrate with electronic components, a lower board thermally connected to the components, a pillar extending between the lower and upper boards, and magnetic material surrounding the pillar, forming an inductor and heat sink configuration that enhances cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If heat-generating power components are placed close to inductive components to reduce space, then miniaturization is achieved, but cooling efficiency decreases because inductive components have low thermal conductivity
Solution Approach 1:
The patent transitions from planar placement to three-dimensional stacking by extending the inductive component vertically with a core portion that protrudes from the substrate surface. This vertical arrangement allows heat-generating power components to be positioned on different layers (above or below the substrate) rather than competing for the same planar space, thereby achieving miniaturization while maintaining adequate thermal management pathways.
Solution Approach 2:
The inductive component is segmented into distinct functional portions: a winding portion for electrical function and a core portion for magnetic function and thermal conduction. The core portion is specifically designed with high thermal conductivity material to serve as a heat dissipation pathway, separating the thermal management function from the electrical/inductive function and allowing optimized placement of power components relative to each segment.
2Temperature
If typical heat sink arrangements are used to cool power components, then cooling is achieved, but a large amount of space is required
Solution Approach 1:
The patent merges the inductive component structure with the heat sink function by making the core portion of the inductor serve dual purposes: maintaining magnetic properties for inductive function and providing high thermal conductivity pathways for heat dissipation. This integration eliminates the need for separate, space-consuming heat sink structures, as the inductor's core itself becomes the primary heat dissipation element.
Solution Approach 2:
The core portion of the inductive component is designed to perform multiple functions simultaneously: it provides magnetic flux path for inductive operation, serves as a thermal conduction pathway for heat dissipation from power components, and maintains the overall inductive component structure. This multi-functionality reduces the total component count and space requirement while achieving effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for miniaturization of power supply modules while maintaining sufficient cooling to support high-current generation, improving performance by effectively dissipating heat and optimizing component placement.
Implementation Method 1
The electronic component can be thermally connected with the lower board through a thermal conductive material
Data Source
AI summary
A power supply module including a substrate, an electronic component provided on an upper surface of the substrate, a lower board electrically connected with the electronic component through the substrate, and an upper board electrically connected another end of the at least one pillar opposing an end of the at least one pillar that is electrically connected with the at least one lower board, the at least one upper board being electrically connected with the substrate. A pillar extends between the lower board and the upper board. The pillar includes a first end electrically connected with the lower board and a second end electrically connected with the upper board. A magnetic material is provided around a periphery of the pillar.