Power Supply Unit Dual-Surface Circuit Board Heat Dissipation
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Solution Overview
Problem
Existing power supply units face limitations in space utilization and heat dissipation due to restricted layout and insufficient cooling solutions for electronic components on the circuit board, particularly for power components that require larger heat sinks or transformers.
Innovation Solution
A power supply unit design that utilizes a heat-dissipation case with a circuit board having two deployment surfaces, where power components are placed on one surface connected to the inner surface of the case for enhanced heat dissipation, while other components are on the opposite surface, allowing for improved space utilization and heat dissipation through thermal conductivity and airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If all electronic components are disposed on the top surface of the circuit board, then the layout is simple and easy to manufacture, but the space utilization is limited and heat dissipation is insufficient
Solution Approach 1:
The patent utilizes both surfaces of the circuit board for component placement, transitioning from a single-surface (2D) layout to a dual-surface (3D) configuration. This allows components to be distributed across the top and bottom surfaces, effectively doubling the available mounting area and improving space utilization without increasing the physical footprint of the circuit board.
Solution Approach 2:
The patent segments the electronic components into different functional groups and distributes them across different surfaces of the circuit board. Power components that generate heat are placed on one surface while other components are placed on the opposite surface, allowing for better thermal management and optimized space utilization.
2Volume of moving object
If all electronic components are disposed on the top surface of the circuit board, then the structure is compact, but the heat dissipation capability is insufficient
Solution Approach 1:
By utilizing both surfaces of the circuit board, the patent creates spatial separation between heat-generating components and other components. This three-dimensional arrangement allows heat to be directed toward the heat-dissipation case while maintaining a compact overall structure, as the increased component capacity comes from using both sides rather than expanding the board footprint.
Solution Approach 2:
The patent extracts heat-generating power components from the general component group and places them in direct thermal contact with the heat-dissipation case. This separation allows for dedicated thermal management of high-power components while maintaining compact dimensions.
3Temperature
If larger heat sinks or cooling fins are provided for power components, then the heat dissipation is improved, but the space constraints on the circuit board prevent this
Solution Approach 1:
The patent extracts the heat dissipation function from traditional large heat sinks and integrates it directly into the heat-dissipation case structure. Power components are placed in direct thermal contact with the case, which itself serves as the heat dissipation mechanism, eliminating the need for separate large heat sink components.
Solution Approach 2:
The patent merges the housing structure with the heat dissipation function by designing the heat-dissipation case to serve dual purposes: protecting the circuit board and actively dissipating heat from power components. This integration eliminates the need for additional space-consuming heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances space utilization by allowing larger components and improves heat dissipation efficiency by conducting heat generated by power components to the heat-dissipation case, thereby increasing the available space on the circuit board and effectively managing thermal energy.
Implementation Method 1
since each said power component is connected to the heat-dissipation case having a heat dissipation function, the heat generated by each said power component during operation can be conducted to the heat-dissipation case to be dissipated
Data Source
AI summary
A power supply unit with improved space utilization and heat dissipation, including a heat-dissipation case, a circuit board and a plurality of electronic components; the circuit board is disposed in the heat-dissipation case, and has a first deployment surface and a second deployment surface in opposite positions; the plurality of electronic components include at least one power component and other electronic components, wherein the other electronic components are disposed on the first deployment surface of the circuit board, and the at least one power component is disposed on the second deployment surface of the circuit board and connects to an inner surface of the heat-dissipation case.