Power Supply Dynamic De-rating for Thermal and Power Constraints

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Solution Overview

Problem

Existing information handling system power supplies face challenges in efficiently managing power output and thermal constraints, leading to increased design and manufacturing costs due to fixed operational ranges that do not adapt to varying conditions, resulting in over-engineering and higher component prices.

Innovation Solution

A system and method that dynamically update power supply shutdown constraints based on measured operating conditions, using a protection constraint adaptive module to adjust output and thermal constraints, allowing the power supply to operate within an extended range by modifying output and thermal limits in response to current and temperature changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If power supplies include robust design with fixed safety buffer (20%) to handle maximum power output, then system reliability is improved, but system cost increases

Engineering Contradiction:
Improvesystem reliabilityVSAvoidsystem cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent implements dynamic adjustment of power supply constraints by monitoring actual power consumption and thermal conditions in real-time. The system continuously adapts the safety buffer from a fixed 20% to a variable parameter based on measured conditions, allowing the power supply to operate more efficiently while maintaining reliability. This resolves the contradiction by making the robust design adaptive rather than static.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the operational parameters (power output limits and thermal constraints) based on actual system conditions. By dynamically adjusting these parameters rather than maintaining fixed conservative limits, the power supply can operate closer to its true capabilities while still ensuring reliability. This reduces over-engineering and associated costs.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If power supplies use fixed OCP and AOTP parameters for safety, then power supply protection is improved, but design and manufacture costs increase

Engineering Contradiction:
Improvepower supply protectionVSAvoiddesign and manufacture costs
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent implements feedback mechanisms that continuously monitor actual power consumption and thermal conditions, then adjust the OCP and AOTP parameters dynamically. This feedback loop allows the system to maintain adequate protection while avoiding the costs associated with fixed conservative parameter settings. The protection adapts to actual conditions rather than relying on predetermined fixed values.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The protection parameters transition from static fixed values to dynamic adjustable values based on real-time monitoring. This dynamic approach maintains safety and reliability while reducing the need for conservative over-engineering, thereby lowering design and manufacture costs.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If AOTP and OCP constraints are increased to provide buffer for multiple system types, then adaptability is improved, but power supply capabilities are sacrificed

Engineering Contradiction:
Improveadaptability to multiple systemsVSAvoidpower supply capabilities
Core Design Contradiction:
Adaptability or versatilityVSPower

Solution Approach 1:

The patent enables the power supply to dynamically adjust its constraints based on the specific system it is powering. Rather than using fixed elevated constraints for all systems, the system adapts its parameters in real-time to match actual power consumption patterns and thermal conditions. This maintains adaptability across different system types while preserving full power supply capabilities.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The dynamic constraint adjustment mechanism allows a single power supply design to serve multiple system types effectively. By adapting parameters based on actual conditions rather than relying on fixed conservative limits, the power supply achieves universal applicability without sacrificing capability in any specific application.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of manufacture

If fixed operational range is used for power supplies, then manufacturing simplicity is improved, but operational flexibility deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidoperational flexibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent transforms the operational range from a fixed static parameter to a dynamic adjustable parameter. The system maintains the simplicity of a standardized power supply design while adding dynamic adaptation capabilities through real-time monitoring and adjustment of operational constraints. This resolves the contradiction by making the operational range flexible without complicating the fundamental design.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS9304565B2Information handling system power supply automated de-rating for power output and thermal constraints
Publication Date: 2016.04.05 DELL SOFTWARE INC
  • US9304565B2 patent drawing
  • US9304565B2 patent drawing
  • US9304565B2 patent drawing

AI summary

An information handling system power supply dynamically adapts thermal and power output protection constraints based upon thermal and power output conditions measured at the power supply. In the event of changing conditions at the information handling system, such as an increase in ambient temperature or an increase in power consumption, a power constraint adaptive module adjusts constraints at which the power supply will shut down in order to maintain power to an information handling system outside of a normal power and thermal constraint operating envelope for the power supply.