High Power Density Power Supply Vertical Filter Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High power density power supplies face challenges with heat dissipation due to limited internal space in standard casings, leading to potential overheating and safety risks from short circuits caused by protruding pins on filter circuit boards.
Innovation Solution
The power supply design includes a casing with a panel, perpendicular power modules, cooling fans, and insulating elements such as buffer pads and an insulating plate to prevent short circuits by maintaining a safe distance between the upper cover and protruding pins on the second filter circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the internal space of the casing is reduced to increase power density, then the power density is improved, but the heat dissipation performance deteriorates
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacked arrangement of filter circuit boards. Multiple filter circuit boards are arranged in layers above and below the cooling fan, utilizing the vertical dimension (Z-axis) to increase component density without expanding the horizontal footprint. This allows more filtering components to be integrated into the limited space while maintaining proper heat dissipation pathways through the vertical stacking configuration.
2Reliability
If electronic components are added to improve filtering capability, then the filtering performance is improved, but the heat dissipation path is blocked
Solution Approach 1:
The filtering function is divided into multiple independent filter circuit boards arranged in separate layers. Each filter circuit board contains specific filtering components (inductors, capacitors) that can be independently positioned and configured. This segmentation allows the filtering components to be distributed in three-dimensional space around the cooling fan, providing adequate filtering capability while maintaining open heat dissipation pathways through the segmented arrangement.
Solution Approach 2:
Filter circuit boards are arranged in vertical layers above and below the cooling fan, utilizing the Z-dimension to stack filtering components. This vertical stacking provides sufficient filtering capability without blocking the horizontal heat dissipation path, as the components are distributed across multiple elevation levels rather than occupying the same plane as the heat dissipation flow.
3Volume of stationary object
If the casing size is reduced for space saving, then the space utilization is improved, but the heat dissipation condition deteriorates
Solution Approach 1:
The patent utilizes vertical stacking of filter circuit boards in the Z-dimension to increase component density within the reduced horizontal footprint. By arranging filters above and below the cooling fan in multiple layers, the design achieves comprehensive filtering capability in a compact form factor without compromising heat dissipation, as the vertical arrangement leaves horizontal pathways open for air flow.
4Volume of stationary object
If power modules are arranged perpendicular to the panel to save space, then the space utilization is improved, but the heat dissipation path becomes restricted
Solution Approach 1:
Power modules and filter circuit boards are arranged in a three-dimensional configuration with vertical stacking in the Z-dimension. The perpendicular arrangement of power modules combined with layered filter boards creates a compact structure that maximizes space utilization while maintaining adequate heat dissipation pathways through the multi-level spatial distribution of components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and prevents short circuits, improving the safety and reliability of high power density power supplies by ensuring effective cooling and insulation.
Implementation Method 1
A plurality of cooling fans 210 are provided in the casing 201... the cooling fan 210 can effectively cool the power module 230
Implementation Method 2
an insulating plate disposed on the buffer pads... the insulating plate completely covers a top of the second filter circuit board... prevent an upper cover of the power supply and a protruding pin of a second filter from forming a short circuit
Data Source
AI summary
A high power density power supply includes at least one power module and a cooling fan in a casing. A first filter circuit board facing upward is provided below the cooling fan. A second filter circuit board facing downward is provided above the cooling fan. The back of the second filter circuit board is provided with a plurality of buffer pads. An insulating plate is disposed on the buffer pads to completely cover the top of the second filter circuit board. Thereby, the insulating plate provided an insulating effect between an upper cover of the casing and the second filter circuit board to prevent the second filter circuit board from directly contacting the upper cover to form a short circuit, so as to improve the safety of the power supply.