Power Supply Heat Transfer Layout for Compact Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power supply apparatuses for electric vehicles face challenges in downsizing while maintaining effective heat dissipation, as the thickness of heat transfer members needs to be increased to improve thermal conductivity, leading to larger installation areas.
Innovation Solution
A power supply apparatus design incorporating a heat transfer member with higher thermal conductivity than the case, featuring a first portion in contact with one outer surface of the case and a second portion in contact with another outer surface, allowing for efficient heat dissipation without increasing the thickness of the side walls, thereby reducing the overall size of the apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness of the side wall and the heat transfer member is increased to improve heat dissipation performance, then the heat dissipation efficiency is improved, but the installation area and overall size of the apparatus increase
Solution Approach 1:
The patent applies composite material structure by combining resin material (lower thermal conductivity) and heat transfer member (higher thermal conductivity) in a hybrid configuration. The heat transfer member is selectively positioned at critical heat generation points (electronic components and reactor) while the resin material fills other spaces, creating a composite thermal management system that optimizes heat dissipation without requiring uniform thickening of all structural components.
Solution Approach 2:
The patent implements local quality by providing heat transfer members only at specific locations where heat generation occurs (electronic components and reactor) rather than uniformly throughout the entire housing. This localized approach concentrates thermal conductivity enhancement exactly where needed, improving heat dissipation efficiency without proportionally increasing the overall installation area.
2Temperature
If a heat transfer member with high thermal conductivity is used, then heat dissipation performance is improved, but the installation area required for the heat transfer member increases
Solution Approach 1:
The patent implements local quality by providing heat transfer members only at specific locations where heat generation occurs (electronic components and reactor) rather than uniformly throughout the entire housing. This localized approach concentrates thermal conductivity enhancement exactly where needed, improving heat dissipation efficiency without proportionally increasing the overall installation area.
Solution Approach 2:
The patent utilizes the internal three-dimensional space of the housing efficiently by positioning heat transfer members in strategic locations and orientations. The heat transfer members are integrated within the existing housing volume rather than adding external extensions, effectively using vertical and lateral dimensions to achieve heat dissipation without increasing the horizontal footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency for both electronic components and reactors, allowing for a more compact design without compromising heat dissipation performance, thus achieving downsizing while ensuring effective thermal management.
Implementation Method 1
a heat transfer member having a thermal conductivity higher than that of the case, the heat transfer member including a first portion disposed in contact with a first outer surface of the case, and a second portion disposed in contact with a second outer surface of the case. The second heating member is disposed in contact with the heat transfer member. When disposed in contact with a wall surface of the heat dissipation housing, the heat transfer member dissipates the heat of the first heating member and the second heating member.
Data Source
AI summary
This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.