Power Supply Thermal Dissipation via Input Port Cavity
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Solution Overview
Problem
Conventional power supplies face challenges in reducing size while maintaining effective heat dissipation, as smaller form factors limit the space for heat dissipation devices like additional plates and fans, leading to potential overheating issues.
Innovation Solution
The power supply design embeds critical components like rectifiers and switching transistors in cavities proximal to the input port, allowing thermal energy to be dissipated through the input port, thereby reducing the need for additional heat dissipation devices and minimizing size while maintaining efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional heat dissipation plates and fans are provided, then heat dissipation performance is improved, but device size increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing input port structure. The input port is designed to serve dual purposes: electrical energy input and thermal energy dissipation. This eliminates the need for separate heat dissipation devices, achieving effective cooling while maintaining compact dimensions.
Solution Approach 2:
The input port is designed as a multi-functional component that simultaneously handles electrical energy reception and thermal energy dissipation. By making the input port serve multiple functions, the patent avoids adding extra components for heat dissipation, thus maintaining small device size while achieving good thermal management.
2Volume of moving object
If device size is reduced, then portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent enables the input port to serve itself by allowing it to dissipate heat generated by the electronic components. The same structure that receives electrical energy also provides a pathway for thermal energy to escape, eliminating the need for dedicated heat dissipation infrastructure and enabling compact design without compromising thermal performance.
Solution Approach 2:
The patent extracts the heat dissipation function from traditional separate components (heatsinks, fans, additional plates) and integrates it into the existing input port structure. This extraction and reintegration allows the device to maintain small size while achieving effective heat dissipation through the input port.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively dissipates thermal energy generated by embedded components, preventing overheating and allowing for a compact power supply design without compromising heat management.
Implementation Method 1
The cavity is arranged proximal to the input port such that at least a portion of thermal energy generated by one or more of the rectifier and the switching transistor is dissipated from the power supply by way of the input port
Data Source
AI summary
A power supply includes a plurality of electronic components including one or more of a rectifier and a switching transistor, an input port configured to receive electrical energy from a power source and a circuit board comprising a cavity. At least one of the rectifier and the switching transistor is embedded in the cavity. The cavity is arranged proximal to the input port such that at least a portion of thermal energy generated by one or more of the rectifier and the switching transistor is dissipated from the power supply by way of the input port.