Power Supply Module Magnetic Mixture Encapsulation
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Solution Overview
Problem
Traditional methods for manufacturing power supply modules face issues such as cracking, poor heat transfer, high cost, and risk of damaging internal components due to excessive pressure, leading to modules with large volume and poor mechanical strength.
Innovation Solution
A manufacturing method involving a magnetic mixture with 85-95% magnetic powder and 5-15% resin, encapsulated under controlled pressure and heat to form a magnetic body that completely encases the coil and electronic components, reducing pressure requirements and enhancing heat transfer and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional cold-pressing process is used for encapsulating magnetic material mixture, then the magnetic body is formed, but the great pressure causes high cost and is likely to damage internal components such as integrated circuits, resistors and capacitors
Solution Approach 1:
The patent changes the physical state parameters of the magnetic material mixture by heating it to a high-temperature molten state before injection. This parameter change allows the material to flow easily into the mold cavity at low pressure, avoiding damage to internal components while still forming a strong magnetic body after cooling and solidification.
Solution Approach 2:
The patent utilizes phase transition of the magnetic material mixture from solid to liquid state through heating. The material is heated to melting point to become molten, injected into the mold, then cooled to solidify into the final magnetic body. This phase transition enables low-pressure forming while maintaining structural integrity.
2Ease of manufacture
If independent electronic components and coils are assembled on PCB substrates and encapsulated by plastic encapsulating material, then the power supply module is formed, but the process generates cracks and has poor heat transfer characteristics
Solution Approach 1:
The patent uses a composite material system consisting of magnetic material mixture (containing magnetic powder, resin, and curing agent) that combines the benefits of magnetic properties, structural strength, and thermal conductivity. This composite material replaces traditional plastic encapsulation, providing both mechanical protection and superior heat transfer while eliminating crack generation during assembly.
Solution Approach 2:
The patent replaces the traditional mechanical assembly process (separate component mounting and plastic encapsulation) with a unified injection molding process. The magnetic material mixture is injected directly around the assembled components in one step, eliminating the need for separate encapsulation operations that cause cracks and poor heat transfer.
3Adaptability or versatility
If magnetic body with pre-processed mounting space is covered on PCB, then components are held, but the process is complex and the power supply module has large volume
Solution Approach 1:
The patent performs preliminary assembly of electronic components and coils on the PCB substrate before injection molding. This preliminary action allows the components to be positioned and fixed in their final locations, and then the magnetic material mixture is injected to encapsulate them, eliminating the need for pre-processed mounting spaces in the magnetic body itself.
Solution Approach 2:
The patent merges the component mounting function and the encapsulation function into a single integrated process. The PCB substrate serves as both the mounting platform for components and the core structure around which the magnetic material is injected, eliminating the need for separate pre-processed mounting spaces and reducing overall complexity.
4Reliability
If traditional encapsulation methods are used, then components are protected, but the manufactured module has large volume and poor heat transfer
Solution Approach 1:
The patent changes the physical and chemical parameters of the encapsulating material by using a magnetic material mixture with specific composition (magnetic powder, resin, curing agent) that cures at elevated temperature. This allows the material to flow into tight spaces around components at low viscosity, then solidify into a compact, space-efficient encapsulation structure with excellent thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a compact, reliable power supply module with improved heat transfer, mechanical strength, and reduced risk of component damage, enabling miniaturization and enhanced performance while lowering production costs.
Implementation Method 1
The pressure applied on the magnetic mixture in the above steps is intermittent with pressure value less than or equal to 0.5 kilogram per square centimeter, with total repetition of 100 to 300 times at a repetition frequency of 100 to 300 times per minute
Implementation Method 2
increasing the temperature of the demoulded magnetic body by heating
Implementation Method 3
applying both the pressure of 5 to 15 kilograms per square centimeter, and the heat with a temperature of 130 to 160 degrees Celsius on the magnetic body for 5 to 20 minutes
Implementation Method 4
making a magnetic mixture, and filling the magnetic mixture in the mold cavity where the connector is placed to form a magnetic body under pressure
Implementation Method 5
applying both the pressure of 5 to 15 kilograms per square centimeter, and the heat with a temperature of 130 to 160 degrees Celsius on the magnetic body for 5 to 20 minutes
Data Source
AI summary
A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demolding the magnetic body from the mold cavity; and increasing the temperature of the demolded magnetic body by heating. In this way, the molding pressure for forming the power supply module is lower and the manufactured power supply module has good performance of heat transfer.