Power Supply Module With Magnetic Core Cavity For IC Protection
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Solution Overview
Problem
Conventional power supply modules face challenges in miniaturization due to the size of the inductor, which limits further size reduction, and suffer from inadequate cooling and increased material costs, as well as exposure of electronic components leading to electromagnetic interference and complex processing procedures.
Innovation Solution
A power supply module design featuring a magnetic core with a cavity to house electronic components, a connector to cover and connect the components to the coil, and a heat-conductive filler to enhance cooling, while minimizing size and protecting the integrated circuit chip from electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are connected in the cavity of the magnetic core, then the power supply module achieves miniaturization, but the electronic components are exposed and cannot be fully protected, and the integrated circuit chip cannot fully contact the magnetic core
Solution Approach 1:
The patent applies the principle of flexible shells and thin films by using a resin encapsulation layer to cover and protect the electronic components within the cavity. The resin forms a protective shell that shields the exposed components while allowing the compact cavity structure to maintain its miniaturized form factor.
2Reliability
If a resin is provided to cover the electronic components, then the components are protected, but the processing procedures increase
Solution Approach 1:
The patent merges the protection function with the existing cavity structure by integrating the resin encapsulation into the same manufacturing process step. The resin is applied to cover the electronic components within the cavity in one continuous operation, combining the protective function with the housing structure rather than treating them as separate assembly steps.
3Manufacturing precision
If the integrated circuit chip leans against the cavity with facing outward, then the chip cannot fully contact the magnetic core, but the cavity must have margin for assembly
Solution Approach 1:
The patent introduces a resin encapsulation material as an intermediary substance that fills the gap between the integrated circuit chip and the cavity wall. This mediator allows the chip to maintain full contact with the magnetic core for effective cooling while the resin provides the necessary assembly margin and protection, resolving the conflict between assembly tolerance and thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves miniaturization, improved cooling, and enhanced protection against electromagnetic interference, simplifying processing and reducing material costs by ensuring full contact of the integrated circuit chip with the magnetic core and utilizing a heat-conductive filler for efficient heat transfer.
Implementation Method 1
utilizing a heat-conductive filler for efficient heat transfer
Data Source
AI summary
A power supply module is disclosed. The power supply module includes: a coil including a coil body and connecting ends; electronic components including at least an integrated circuit chip; a magnetic core which encloses the coil body, wherein at least one side of the magnetic core has a cavity provided therein, and the at least one electronic component is positioned in the cavity; a connector, which abuts against the side of the magnetic core having the cavity therein, covers the surface of the side, and is electronically connected to the coil and the electronic components. The power supply module is able to reduce the damage to the integrated circuit chip, decrease electromagnetic interferences and achieve an excellent cooling effect.